| |
| 2006 | ||
|---|---|---|
| 3 | EE | M. Yamashita, K. Suganuma: Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. Microelectronics Reliability 46(5-6): 850-858 (2006) |
| 2 | EE | M. Yamashita, K. Suganuma: Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure. Microelectronics Reliability 46(7): 1113-1118 (2006) |
| 2003 | ||
| 1 | EE | K. S. Kim, S. H. Huh, K. Suganuma: Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectronics Reliability 43(2): 259-267 (2003) |
| 1 | S. H. Huh | [1] |
| 2 | K. S. Kim | [1] |
| 3 | M. Yamashita | [2] [3] |