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K. Suganuma

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2006
3EEM. Yamashita, K. Suganuma: Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. Microelectronics Reliability 46(5-6): 850-858 (2006)
2EEM. Yamashita, K. Suganuma: Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure. Microelectronics Reliability 46(7): 1113-1118 (2006)
2003
1EEK. S. Kim, S. H. Huh, K. Suganuma: Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectronics Reliability 43(2): 259-267 (2003)

Coauthor Index

1S. H. Huh [1]
2K. S. Kim [1]
3M. Yamashita [2] [3]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)