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Y. J. Su

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2005
7EEC. F. Tsang, C. K. Chang, A. Krishnamoorthy, K. Y. Ee, Y. J. Su, H. Y. Li, W. H. Li, L. Y. Wong: A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections. Microelectronics Reliability 45(3-4): 517-525 (2005)
6EEH. Y. Li, Y. J. Su, C. F. Tsang, S. M. Sohan, V. N. Bliznetsov, L. Zhang: Process improvement of 0.13mum Cu/Low K (Black DiamondTM) dual damascene interconnection. Microelectronics Reliability 45(7-8): 1134-1143 (2005)
2004
5EEC. F. Tsang, C. Y. Li, A. Krishnamoorthy, Y. J. Su, H. Y. Li, L. Y. Wong, W. H. Li, L. J. Tang, K. Y. Ee: Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectronics Journal 35(9): 693-700 (2004)
2003
4EEC. F. Tsang, V. N. Bliznetsov, Y. J. Su: Study and improvement of electrical performance of 130 nm Cu/CVD low k SiOCH interconnect related to via etch process. Microelectronics Journal 34(11): 1051-1058 (2003)
3EEY. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo: Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectronics Journal 34(2): 109-113 (2003)
2EEY. J. Su, S. Arisawa, Y. Takano, A. Ishii, T. Hatano, K. Togano: Study on the growth mechanism of Bi-2212 ribbon-like thin films on flat Ag substrate by the atomization technique. Microelectronics Journal 34(5-8): 679-681 (2003)
1EEY. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003)

Coauthor Index

1S. Arisawa [2]
2V. N. Bliznetsov [4] [6]
3C. K. Chang [7]
4K. Y. Ee [5] [7]
5P. D. Foo [1] [3]
6Q. Guo [3]
7T. Hatano [2]
8A. Ishii [2]
9A. Krishnamoorthy [5] [7]
10C. Y. Li [5]
11H. Y. Li [5] [6] [7]
12W. H. Li [5] [7]
13S. M. Sohan [6]
14Y. Takano [2]
15L. J. Tang [5]
16K. Togano [2]
17C. F. Tsang [4] [5] [6] [7]
18L. Y. Wong [5] [7]
19B. Yu [1]
20L. Zhang [6]
21Y. S. Zheng [1] [3]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)