J. L. Ou
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2003
1
EE
R. K. Shiue
,
L. W. Tsay
,
C. L. Lin
, J. L. Ou: The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate.
Microelectronics Reliability 43
(3): 453-463 (2003)
Coauthor
Index
1
C. L. Lin
[
1
]
2
R. K. Shiue
[
1
]
3
L. W. Tsay
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
