2003 | ||
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1 | EE | Yong-Ha Song, S. G. Kim, S. B. Lee, K. J. Rhee, T. S. Kim: A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology. Microelectronics Reliability 43(9-11): 1405-1410 (2003) |
1 | S. G. Kim | [1] |
2 | T. S. Kim | [1] |
3 | S. B. Lee | [1] |
4 | Yong-Ha Song | [1] |