| |
| 2003 | ||
|---|---|---|
| 1 | EE | G. Lefranc, B. Weiss, C. Klos, J. Dick, G. Khatibi, H. Berg: Aluminum bond-wire properties after 1 billion mechanical cycles. Microelectronics Reliability 43(9-11): 1833-1838 (2003) |
| 1 | H. Berg | [1] |
| 2 | J. Dick | [1] |
| 3 | G. Khatibi | [1] |
| 4 | G. Lefranc | [1] |
| 5 | B. Weiss | [1] |