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2006 | ||
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2 | EE | Fei Su, Kerm Sin Chian, Sung Yi: An optical characterization technique for hygroscopic expansion of polymers and plastic packages. Microelectronics Reliability 46(2-4): 600-609 (2006) |
2003 | ||
1 | EE | W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi: Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability 43(5): 765-774 (2003) |
1 | W. D. van Driel | [1] |
2 | L. J. Ernst | [1] |
3 | J. H. J. Janssen | [1] |
4 | F. Su | [1] |
5 | Fei Su | [2] |
6 | Sung Yi | [1] [2] |
7 | G. Q. Zhang | [1] |