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Joachim C. Reiner

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2005
4EEPeter Jacob, Uwe Thiemann, Joachim C. Reiner: Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing. Microelectronics Reliability 45(7-8): 1174-1180 (2005)
2003
3EEJoachim C. Reiner: Pre-breakdown leakage current fluctuations of thin gate oxide. Microelectronics Reliability 43(9-11): 1507-1512 (2003)
2002
2EEJoachim C. Reiner, Philippe Gasser, Urs Sennhauser: Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown. Microelectronics Reliability 42(9-11): 1753-1757 (2002)
2001
1 Joachim C. Reiner, Thomas Keller: Relevance of contact reliability in HBM-ESD test equipment. Microelectronics Reliability 41(9-10): 1397-1401 (2001)

Coauthor Index

1Philippe Gasser [2]
2Peter Jacob [4]
3Thomas Keller [1]
4Urs Sennhauser [2]
5Uwe Thiemann [4]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)