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2005 | ||
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4 | EE | Peter Jacob, Uwe Thiemann, Joachim C. Reiner: Electrostatic discharge directly to the chip surface, caused by automatic post-wafer processing. Microelectronics Reliability 45(7-8): 1174-1180 (2005) |
2003 | ||
3 | EE | Joachim C. Reiner: Pre-breakdown leakage current fluctuations of thin gate oxide. Microelectronics Reliability 43(9-11): 1507-1512 (2003) |
2002 | ||
2 | EE | Joachim C. Reiner, Philippe Gasser, Urs Sennhauser: Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown. Microelectronics Reliability 42(9-11): 1753-1757 (2002) |
2001 | ||
1 | Joachim C. Reiner, Thomas Keller: Relevance of contact reliability in HBM-ESD test equipment. Microelectronics Reliability 41(9-10): 1397-1401 (2001) |
1 | Philippe Gasser | [2] |
2 | Peter Jacob | [4] |
3 | Thomas Keller | [1] |
4 | Urs Sennhauser | [2] |
5 | Uwe Thiemann | [4] |