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| 2003 | ||
|---|---|---|
| 1 | EE | Sherry Suat Cheng Khoo, Pee Ya Tan, Steven H. Voldman: Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects. Microelectronics Reliability 43(7): 1039-1045 (2003) |
| 1 | Pee Ya Tan | [1] |
| 2 | Steven H. Voldman | [1] |