P. D. Foo

List of publications from the DBLP Bibliography Server - FAQ

2003

2 EE Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo: Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectronics Journal 34(2): 109-113 (2003)

1 EE Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003)

2003
2	EE	Y. S. Zheng, Q. Guo, Y. J. Su, P. D. Foo: Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. Microelectronics Journal 34(2): 109-113 (2003)
1	EE	Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003)

Coauthor Index