Deok-Hoon Kim

2003
2	EE	John J. H. Reche, Deok-Hoon Kim: Wafer level packaging having bump-on-polymer structure. Microelectronics Reliability 43(6): 879-894 (2003)
2002
1	EE	Deok-Hoon Kim, Peter Elenius, Michael Johnson, Scott Barrett: Solder joint reliability of a polymer reinforced wafer level package. Microelectronics Reliability 42(12): 1837-1848 (2002)

Coauthor Index

1	Scott Barrett	[1]
2	Peter Elenius	[1]
3	Michael Johnson	[1]
4	John J. H. Reche	[2]

Colors in the list of coauthors