| 2007 |
|---|
| 10 | EE | Andrzej Dziedzic,
Jan Felba:
Polytronic 2005.
Microelectronics Reliability 47(2-3): 327 (2007) |
| 9 | EE | Andrzej Dziedzic:
Carbon/polyesterimide thick-film resistive composites - Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties.
Microelectronics Reliability 47(2-3): 354-362 (2007) |
| 2006 |
|---|
| 8 | EE | Andrzej Dziedzic,
Andrzej Kolek,
Waleed Ehrhardt,
Heiko Thust:
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors.
Microelectronics Reliability 46(2-4): 352-359 (2006) |
| 2005 |
|---|
| 7 | EE | Andrzej Dziedzic:
IMAPS Poland 2004 - Guest Editorial.
Microelectronics Reliability 45(12): 1901-1902 (2005) |
| 6 | EE | Darko Belavic,
Marko Hrovat,
Jaroslaw Kita,
Janez Holc,
Jena Cilensek,
Leszek J. Golonka,
Andrzej Dziedzic:
Evaluation of compatibility of thick-film PTC thermistors and LTCC structures.
Microelectronics Reliability 45(12): 1924-1929 (2005) |
| 5 | EE | Marek Wronski,
Slawomir Kaminski,
Edward Mis,
Andrzej Dziedzic:
New trim configurations for laser trimmed thick-film resistors - theoretical analysis, numerical simulation and experimental verification.
Microelectronics Reliability 45(12): 1941-1948 (2005) |
| 2003 |
|---|
| 4 | EE | Andrzej Dziedzic:
Special Section on IMAPS-Europe 2002.
Microelectronics Reliability 43(3): 343 (2003) |
| 3 | EE | Andrzej Dziedzic,
Lars Rebenklau,
Leszek J. Golonka,
Klaus-Jürgen Wolter:
Fodel microresistors-processing and basic electrical properties.
Microelectronics Reliability 43(3): 377-383 (2003) |
| 2002 |
|---|
| 2 | EE | Andrzej Dziedzic:
Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components.
Microelectronics Reliability 42(4-5): 709-719 (2002) |
| 2001 |
|---|
| 1 | EE | Andrzej Dziedzic,
Leszek J. Golonka,
Jaroslaw Kita,
Heiko Thust,
Karl-Heinz Drue,
Reinhard Bauer,
Lars Rebenklau,
Klaus-Jürgen Wolter:
Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors.
Microelectronics Reliability 41(5): 669-676 (2001) |
