| |
| 2003 | ||
|---|---|---|
| 1 | EE | Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, Eric Beyne: Direct gold and copper wires bonding on copper. Microelectronics Reliability 43(6): 913-923 (2003) |
| 1 | Eric Beyne | [1] |
| 2 | Wai Lam | [1] |
| 3 | Petar Ratchev | [1] |
| 4 | Serguei Stoukatch | [1] |
| 5 | Charles J. Vath | [1] |