Kozo Harada
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2003
1
EE
Yuko Sawada
, Kozo Harada,
Hirofumi Fujioka
: Study of package warp behavior for high-performance flip-chip BGA.
Microelectronics Reliability 43
(3): 465-471 (2003)
Coauthor
Index
1
Hirofumi Fujioka
[
1
]
2
Yuko Sawada
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
