| 2005 |
|---|
| 3 | EE | F. Palumbo,
G. Condorelli,
S. Lombardo,
K. L. Pey,
C. H. Tung,
L. J. Tang:
Structure of the oxide damage under progressive breakdown.
Microelectronics Reliability 45(5-6): 845-848 (2005) |
| 2004 |
|---|
| 2 | EE | C. F. Tsang,
C. Y. Li,
A. Krishnamoorthy,
Y. J. Su,
H. Y. Li,
L. Y. Wong,
W. H. Li,
L. J. Tang,
K. Y. Ee:
Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization.
Microelectronics Journal 35(9): 693-700 (2004) |
| 2003 |
|---|
| 1 | EE | K. L. Pey,
C. H. Tung,
M. K. Radhakrishnan,
L. J. Tang,
Y. Sun,
X. D. Wang,
W. H. Lin:
Correlation of failure mechanism of constant-current-stress and constant-voltage-stress breakdowns in ultrathin gate oxides of nMOSFETs by TEM.
Microelectronics Reliability 43(9-11): 1471-1476 (2003) |
