| 2007 |
|---|
| 4 | EE | C. Andersson,
D. R. Andersson,
P. E. Tegehall,
Johan Liu:
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints.
Microelectronics Reliability 47(2-3): 266-272 (2007) |
| 2004 |
|---|
| 3 | EE | Zhimin Mo,
Helge Kristiansen,
Morten Eliassen,
Shiming Li,
Johan Liu:
Study on thermomechanical reliability of a tunable light modulator.
Microelectronics Reliability 44(5): 779-785 (2004) |
| 2003 |
|---|
| 2 | EE | Johan Liu:
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5.
Microelectronics Reliability 43(4): 681-683 (2003) |
| 1 | EE | Li-Rong Zheng,
Johan Liu:
System-on-package: a broad perspective from system design to technology development.
Microelectronics Reliability 43(8): 1339-1348 (2003) |
