| 2007 |
|---|
| 4 | EE | Mike Roellig,
Rainer Dudek,
Steffen Wiese,
Bjoern Boehme,
Berhard Wunderle,
Klaus-Jürgen Wolter,
Bernd Michel:
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept.
Microelectronics Reliability 47(2-3): 187-195 (2007) |
| 3 | EE | Steffen Wiese,
Klaus-Jürgen Wolter:
Creep of thermally aged SnAgCu-solder joints.
Microelectronics Reliability 47(2-3): 223-232 (2007) |
| 2003 |
|---|
| 2 | EE | Andrzej Dziedzic,
Lars Rebenklau,
Leszek J. Golonka,
Klaus-Jürgen Wolter:
Fodel microresistors-processing and basic electrical properties.
Microelectronics Reliability 43(3): 377-383 (2003) |
| 2001 |
|---|
| 1 | EE | Andrzej Dziedzic,
Leszek J. Golonka,
Jaroslaw Kita,
Heiko Thust,
Karl-Heinz Drue,
Reinhard Bauer,
Lars Rebenklau,
Klaus-Jürgen Wolter:
Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors.
Microelectronics Reliability 41(5): 669-676 (2001) |
