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K. H. Chua

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2005
5EEY. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin: New encapsulation development for fine pitch IC devices. Microelectronics Reliability 45(7-8): 1222-1229 (2005)
2004
4EET. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma: The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectronics Reliability 44(4): 603-609 (2004)
2003
3EEY. F. Yao, T. Y. Lin, K. H. Chua: Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectronics Reliability 43(12): 2039-2045 (2003)
2EET. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua: Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability 43(5): 811-817 (2003)
2002
1EET. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability 42(3): 375-380 (2002)

Coauthor Index

1J. W. Chai [1]
2D. Crouthamel [4]
3C. M. Fang [2]
4W. S. Leong [1]
5T. Y. Lin [1] [2] [3] [4] [5]
6Y. Y. Ma [4]
7Y. Miao [1]
8B. Njoman [4] [5]
9R. Oh [1]
10J. S. Pan [1]
11S. Y. Teo [4]
12Y. F. Yao [2] [3] [5]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)