Sung Yi

2006
2	EE	Fei Su, Kerm Sin Chian, Sung Yi: An optical characterization technique for hygroscopic expansion of polymers and plastic packages. Microelectronics Reliability 46(2-4): 600-609 (2006)
2003
1	EE	W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi: Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability 43(5): 765-774 (2003)

Coauthor Index

1	Kerm Sin Chian	[1] [2]
2	W. D. van Driel	[1]
3	L. J. Ernst	[1]
4	J. H. J. Janssen	[1]
5	F. Su	[1]
6	Fei Su	[2]
7	G. Q. Zhang	[1]