S. H. Huh

List of publications from the DBLP Bibliography Server - FAQ

2003

1 EE K. S. Kim, S. H. Huh, K. Suganuma: Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectronics Reliability 43(2): 259-267 (2003)

2003
1	EE	K. S. Kim, S. H. Huh, K. Suganuma: Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectronics Reliability 43(2): 259-267 (2003)

Coauthor Index