| 2004 |
|---|
| 3 | EE | Yi Tao,
Ajay P. Malshe,
William D. Brown:
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems.
Microelectronics Reliability 44(2): 251-258 (2004) |
| 2003 |
|---|
| 2 | EE | Ajit R. Dhamdhere,
Ajay P. Malshe,
William F. Schmidt,
William D. Brown:
Investigation of reliability issues in high power laser diode bar packages.
Microelectronics Reliability 43(2): 287-295 (2003) |
| 1995 |
|---|
| 1 | EE | Hameed A. Naseem,
Ajay P. Malshe,
Rajan A. Beera,
M. Shahid Haque,
William D. Brown,
Len W. Schaper:
CVD-diamond substrates for multi-chip modules (MCMs).
VLSI Design 1995: 194- |
