| |
| 2003 | ||
|---|---|---|
| 1 | EE | P. Rajamand, R. Tilgner, R. Schmidt, J. Baumann, P. Klofac, M. Rothenfusser: Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures. Microelectronics Reliability 43(9-11): 1815-1820 (2003) |
| 1 | J. Baumann | [1] |
| 2 | P. Klofac | [1] |
| 3 | P. Rajamand | [1] |
| 4 | R. Schmidt | [1] |
| 5 | R. Tilgner | [1] |