2006 |
11 | EE | Päivi H. Karjalainen,
Eero Ristolainen:
Balancing temperature dependence of on-wafer SOS inductors.
Microelectronics Reliability 46(7): 1071-1079 (2006) |
2005 |
10 | EE | L. Frisk,
Eero Ristolainen:
Flip chip attachment on flexible LCP substrate using an ACF.
Microelectronics Reliability 45(3-4): 583-588 (2005) |
2004 |
9 | EE | S. Nurmi,
J. Sundelin,
Eero Ristolainen,
T. Lepistö:
The effect of solder paste composition on the reliability of SnAgCu joints.
Microelectronics Reliability 44(3): 485-494 (2004) |
8 | EE | A. Seppälä,
Eero Ristolainen:
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints.
Microelectronics Reliability 44(4): 639-648 (2004) |
2003 |
7 | EE | S. Myllymaki,
Eero Ristolainen,
P. Heino,
A. Lehto,
K. Varjonen:
Evaluation Of Resonating Channel Transistor In SOI Wafer.
International Journal of Computational Engineering Science 4(3): 711-714 (2003) |
6 | EE | P. Heino,
Eero Ristolainen:
Thermal conduction at the nanoscale in some metals by MD.
Microelectronics Journal 34(9): 773-777 (2003) |
5 | EE | P. Heino,
Eero Ristolainen:
Strength of Ta-Si interfaces by molecular dynamics.
Microelectronics Reliability 43(4): 645-650 (2003) |
2002 |
4 | EE | Erja Jokinen,
Eero Ristolainen:
Anisotropic conductive film flip chip joining using thin chips.
Microelectronics Reliability 42(12): 1913-1920 (2002) |
3 | EE | T. Alander,
S. Nurmi,
P. Heino,
Eero Ristolainen:
Impact of component placement in solder joint reliability.
Microelectronics Reliability 42(3): 399-406 (2002) |
2 | EE | A. Seppälä,
T. Allinniemi,
Eero Ristolainen:
Failure mechanisms of adhesive flip chip joints.
Microelectronics Reliability 42(9-11): 1547-1550 (2002) |
2001 |
1 | EE | Petteri Palm,
Jarmo Määttänen,
Aulis Tuominen,
Eero Ristolainen:
Reliability of 80 mum pitch flip chip attachment on flex.
Microelectronics Reliability 41(5): 633-638 (2001) |