2006 | ||
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17 | EE | C. Bestory, F. Marc, H. Levi, Y. Danto: Multi-level Modeling of Hot Carrier Injection for Reliability. FDL 2006: 61-68 |
16 | EE | W. C. Maia Filho, M. Brizoux, H. Frémont, Y. Danto: Improved physical understanding of intermittent failure in continuous monitoring method. Microelectronics Reliability 46(9-11): 1886-1891 (2006) |
2005 | ||
15 | EE | S. Huyghe, L. Béchou, N. Zerounian, Y. Deshayes, F. Aniel, A. Denolle, D. Laffitte, J. L. Goudard, Y. Danto: Electroluminescence spectroscopy for reliability investigations of 1.55 mum bulk semiconductor optical amplifier. Microelectronics Reliability 45(9-11): 1593-1599 (2005) |
14 | EE | A. Dehbi, Y. Ousten, Y. Danto, W. Wondrak: Vibration lifetime modelling of PCB assemblies using steinberg model. Microelectronics Reliability 45(9-11): 1658-1661 (2005) |
2003 | ||
13 | EE | F. Marc, B. Mongellaz, Y. Danto: Reliability simulation of electronic circuits with VHDL-AMS. FDL 2003: 175-184 |
12 | EE | T. Beauchêne, D. Lewis, Felix Beaudoin, V. Pouget, Philippe Perdu, P. Fouillat, Y. Danto: A physical approach on SCOBIC investigation in VLSI. Microelectronics Reliability 43(1): 173-177 (2003) |
11 | EE | Y. Deshayes, L. Béchou, J.-Y. Delétage, F. Verdier, Y. Danto, D. Laffitte, J. L. Goudard: Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules. Microelectronics Reliability 43(7): 1125-1136 (2003) |
10 | EE | J.-Y. Delétage, F. J.-M. Verdier, B. Plano, Y. Deshayes, L. Béchou, Y. Danto: Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations. Microelectronics Reliability 43(7): 1137-1144 (2003) |
9 | EE | B. Mongellaz, F. Marc, Y. Danto: Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study. Microelectronics Reliability 43(9-11): 1513-1518 (2003) |
8 | EE | L. Mendizabal, Jean-Louis Verneuil, L. Béchou, Christelle Aupetit-Berthelemot, Y. Deshayes, F. Verdier, Jean-Michel Dumas, Y. Danto, D. Laffitte, J. L. Goudard: Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulator. Microelectronics Reliability 43(9-11): 1743-1749 (2003) |
7 | EE | G. Andriamonje, V. Pouget, Y. Ousten, D. Lewis, Y. Danto, J. M. Rampnoux, Y. Ezzahri, Stefan Dilhaire, Stéphane Grauby, Wilfrid Claeys: Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits. Microelectronics Reliability 43(9-11): 1803-1807 (2003) |
6 | EE | A. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto: Moisture diffusion in BCB resins used for MEMS packaging. Microelectronics Reliability 43(9-11): 1939-1944 (2003) |
2002 | ||
5 | EE | A. Dehbi, W. Wondrak, Y. Ousten, Y. Danto: High temperature reliability testing of aluminum and tantalum electrolytic capacitors. Microelectronics Reliability 42(6): 835-840 (2002) |
4 | EE | B. Trégon, Y. Ousten, Y. Danto, L. Béchou, B. Parmentier: Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions. Microelectronics Reliability 42(7): 1113-1120 (2002) |
3 | EE | B. Mongellaz, F. Marc, N. Milet-Lewis, Y. Danto: Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language. Microelectronics Reliability 42(9-11): 1353-1358 (2002) |
2 | EE | J. Augereau, Y. Ousten, L. Béchou, Y. Danto: Acoustic analysis of an assembly: Structural identification by signal processing (wavelets). Microelectronics Reliability 42(9-11): 1517-1522 (2002) |
1 | EE | G. Duchamp, Y. Ousten, Y. Danto: Evaluation of a micropackaging analysis technique by highfrequency microwaves. Microelectronics Reliability 42(9-11): 1551-1554 (2002) |