2006 |
17 | EE | C. Bestory,
F. Marc,
H. Levi,
Y. Danto:
Multi-level Modeling of Hot Carrier Injection for Reliability.
FDL 2006: 61-68 |
16 | EE | W. C. Maia Filho,
M. Brizoux,
H. Frémont,
Y. Danto:
Improved physical understanding of intermittent failure in continuous monitoring method.
Microelectronics Reliability 46(9-11): 1886-1891 (2006) |
2005 |
15 | EE | S. Huyghe,
L. Béchou,
N. Zerounian,
Y. Deshayes,
F. Aniel,
A. Denolle,
D. Laffitte,
J. L. Goudard,
Y. Danto:
Electroluminescence spectroscopy for reliability investigations of 1.55 mum bulk semiconductor optical amplifier.
Microelectronics Reliability 45(9-11): 1593-1599 (2005) |
14 | EE | A. Dehbi,
Y. Ousten,
Y. Danto,
W. Wondrak:
Vibration lifetime modelling of PCB assemblies using steinberg model.
Microelectronics Reliability 45(9-11): 1658-1661 (2005) |
2003 |
13 | EE | F. Marc,
B. Mongellaz,
Y. Danto:
Reliability simulation of electronic circuits with VHDL-AMS.
FDL 2003: 175-184 |
12 | EE | T. Beauchêne,
D. Lewis,
Felix Beaudoin,
V. Pouget,
Philippe Perdu,
P. Fouillat,
Y. Danto:
A physical approach on SCOBIC investigation in VLSI.
Microelectronics Reliability 43(1): 173-177 (2003) |
11 | EE | Y. Deshayes,
L. Béchou,
J.-Y. Delétage,
F. Verdier,
Y. Danto,
D. Laffitte,
J. L. Goudard:
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules.
Microelectronics Reliability 43(7): 1125-1136 (2003) |
10 | EE | J.-Y. Delétage,
F. J.-M. Verdier,
B. Plano,
Y. Deshayes,
L. Béchou,
Y. Danto:
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations.
Microelectronics Reliability 43(7): 1137-1144 (2003) |
9 | EE | B. Mongellaz,
F. Marc,
Y. Danto:
Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study.
Microelectronics Reliability 43(9-11): 1513-1518 (2003) |
8 | EE | L. Mendizabal,
Jean-Louis Verneuil,
L. Béchou,
Christelle Aupetit-Berthelemot,
Y. Deshayes,
F. Verdier,
Jean-Michel Dumas,
Y. Danto,
D. Laffitte,
J. L. Goudard:
Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulator.
Microelectronics Reliability 43(9-11): 1743-1749 (2003) |
7 | EE | G. Andriamonje,
V. Pouget,
Y. Ousten,
D. Lewis,
Y. Danto,
J. M. Rampnoux,
Y. Ezzahri,
Stefan Dilhaire,
Stéphane Grauby,
Wilfrid Claeys:
Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits.
Microelectronics Reliability 43(9-11): 1803-1807 (2003) |
6 | EE | A. Tetelin,
C. Pellet,
J.-Y. Delétage,
B. Carbonne,
Y. Danto:
Moisture diffusion in BCB resins used for MEMS packaging.
Microelectronics Reliability 43(9-11): 1939-1944 (2003) |
2002 |
5 | EE | A. Dehbi,
W. Wondrak,
Y. Ousten,
Y. Danto:
High temperature reliability testing of aluminum and tantalum electrolytic capacitors.
Microelectronics Reliability 42(6): 835-840 (2002) |
4 | EE | B. Trégon,
Y. Ousten,
Y. Danto,
L. Béchou,
B. Parmentier:
Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions.
Microelectronics Reliability 42(7): 1113-1120 (2002) |
3 | EE | B. Mongellaz,
F. Marc,
N. Milet-Lewis,
Y. Danto:
Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language.
Microelectronics Reliability 42(9-11): 1353-1358 (2002) |
2 | EE | J. Augereau,
Y. Ousten,
L. Béchou,
Y. Danto:
Acoustic analysis of an assembly: Structural identification by signal processing (wavelets).
Microelectronics Reliability 42(9-11): 1517-1522 (2002) |
1 | EE | G. Duchamp,
Y. Ousten,
Y. Danto:
Evaluation of a micropackaging analysis technique by highfrequency microwaves.
Microelectronics Reliability 42(9-11): 1551-1554 (2002) |