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Guo Lihui

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2004
2EEGuo Lihui, Zhang Yibin, Su Yong Jie Jeffrey: Integrating thick copper/Black DiamondTM layer in CMOS interconnect process for RF passive components. Microelectronics Reliability 44(4): 581-585 (2004)
2003
1EEGuo Lihui, Yu Mingbin, Foo Pang Dow: RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology. Microelectronics Reliability 43(3): 367-370 (2003)

Coauthor Index

1Foo Pang Dow [1]
2Su Yong Jie Jeffrey [2]
3Yu Mingbin [1]
4Zhang Yibin [2]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)