2004 | ||
---|---|---|
2 | EE | Guo Lihui, Zhang Yibin, Su Yong Jie Jeffrey: Integrating thick copper/Black DiamondTM layer in CMOS interconnect process for RF passive components. Microelectronics Reliability 44(4): 581-585 (2004) |
2003 | ||
1 | EE | Guo Lihui, Yu Mingbin, Foo Pang Dow: RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology. Microelectronics Reliability 43(3): 367-370 (2003) |
1 | Foo Pang Dow | [1] |
2 | Su Yong Jie Jeffrey | [2] |
3 | Yu Mingbin | [1] |
4 | Zhang Yibin | [2] |