| 2004 |
|---|
| 5 | EE | S. C. Tan,
Y. C. Chan,
Y. W. Chiu,
C. W. Tan:
Thermal stability performance of anisotropic conductive film at different bonding temperatures.
Microelectronics Reliability 44(3): 495-503 (2004) |
| 4 | EE | C. W. Tan,
Y. C. Chan,
H. P. Chan,
N. W. Leung,
C. K. So:
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.
Microelectronics Reliability 44(5): 823-831 (2004) |
| 2003 |
|---|
| 3 | EE | C. W. Tan,
Y. C. Chan,
N. H. Yeung:
Effect of autoclave test on anisotropic conductive joints.
Microelectronics Reliability 43(2): 279-285 (2003) |
| 2 | EE | C. W. Tan,
Y. C. Chan,
N. H. Yeung:
Behaviour of anisotropic conductive joints under mechanical loading.
Microelectronics Reliability 43(3): 481-486 (2003) |
| 1999 |
|---|
| 1 | EE | C. W. Tan,
Angela Goh:
Implementing ECA rules in an active database.
Knowl.-Based Syst. 12(4): 137-144 (1999) |
