C. W. Tan

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5EES. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan: Thermal stability performance of anisotropic conductive film at different bonding temperatures. Microelectronics Reliability 44(3): 495-503 (2004)
4EEC. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So: Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectronics Reliability 44(5): 823-831 (2004)
3EEC. W. Tan, Y. C. Chan, N. H. Yeung: Effect of autoclave test on anisotropic conductive joints. Microelectronics Reliability 43(2): 279-285 (2003)
2EEC. W. Tan, Y. C. Chan, N. H. Yeung: Behaviour of anisotropic conductive joints under mechanical loading. Microelectronics Reliability 43(3): 481-486 (2003)
1EEC. W. Tan, Angela Goh: Implementing ECA rules in an active database. Knowl.-Based Syst. 12(4): 137-144 (1999)

Coauthor Index

1H. P. Chan [4]
2Y. C. Chan [2] [3] [4] [5]
3Y. W. Chiu [5]
4Angela Goh (Angela Eck Soong Goh) [1]
5N. W. Leung [4]
6C. K. So [4]
7S. C. Tan [5]
8N. H. Yeung [2] [3]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)