X. Q. Shi

2004
2	EE	X. Q. Shi, H. L. J. Pang, X. R. Zhang: Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectronics Reliability 44(5): 841-852 (2004)
2003
1	EE	X. Q. Shi, Z. P. Wang, J. P. Pickering: A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages. Microelectronics Reliability 43(7): 1105-1115 (2003)

Coauthor Index

1	H. L. J. Pang	[2]
2	J. P. Pickering	[1]
3	Z. P. Wang	[1]
4	X. R. Zhang	[2]

Colors in the list of coauthors