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| 2003 | ||
|---|---|---|
| 2 | EE | Petteri Palm, Jarmo Määttänen, Yannick De Maquillé, Alain Picault, Jan Vanfleteren, Björn Vandecasteele: Comparison of different flex materials in high density flip chip on flex applications. Microelectronics Reliability 43(3): 445-451 (2003) |
| 2001 | ||
| 1 | EE | Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen: Reliability of 80 mum pitch flip chip attachment on flex. Microelectronics Reliability 41(5): 633-638 (2001) |
| 1 | Jarmo Määttänen | [1] [2] |
| 2 | Yannick De Maquillé | [2] |
| 3 | Alain Picault | [2] |
| 4 | Eero Ristolainen | [1] |
| 5 | Aulis Tuominen | [1] |
| 6 | Björn Vandecasteele | [2] |
| 7 | Jan Vanfleteren | [2] |