| |
| 2003 | ||
|---|---|---|
| 1 | EE | Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga: Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. Microelectronics Reliability 43(5): 751-756 (2003) |
| 1 | Toshihiro Itoh | [1] |
| 2 | Tadatomo Suga | [1] |
| 3 | Qian Wang | [1] |