| |
| 2005 | ||
|---|---|---|
| 3 | EE | Alberto Tosi, Franco Stellari, F. Zappa: Innovative packaging technique for backside optical testing of wire-bonded chips. Microelectronics Reliability 45(9-11): 1493-1498 (2005) |
| 2003 | ||
| 2 | EE | Alberto Tosi, Franco Stellari, F. Zappa, S. Cova: Backside Flip-Chip testing by means of high-bandwidth luminescence detection. Microelectronics Reliability 43(9-11): 1669-1674 (2003) |
| 2001 | ||
| 1 | EE | Franco Stellari, F. Zappa, S. Cova, L. Vendrame: Tools for contactless testing and simulation of CMOS circuits. Microelectronics Reliability 41(11): 1801-1808 (2001) |
| 1 | S. Cova | [1] [2] |
| 2 | Franco Stellari | [1] [2] [3] |
| 3 | Alberto Tosi | [2] [3] |
| 4 | L. Vendrame | [1] |