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B. Yu

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2004
2EEB. Yu, A. H. C. van Paassen: Simulink and bond graph modeling of an air-conditioned room. Simulation Modelling Practice and Theory 12(1): 61-76 (2004)
2003
1EEY. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003)

Coauthor Index

1P. D. Foo [1]
2A. H. C. van Paassen [2]
3Y. J. Su [1]
4Y. S. Zheng [1]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)