| |
| 2004 | ||
|---|---|---|
| 2 | EE | B. Yu, A. H. C. van Paassen: Simulink and bond graph modeling of an air-conditioned room. Simulation Modelling Practice and Theory 12(1): 61-76 (2004) |
| 2003 | ||
| 1 | EE | Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo: Investigation of defect on copper bond pad surface in copper/low k process integration. Microelectronics Reliability 43(8): 1311-1316 (2003) |
| 1 | P. D. Foo | [1] |
| 2 | A. H. C. van Paassen | [2] |
| 3 | Y. J. Su | [1] |
| 4 | Y. S. Zheng | [1] |