2003 | ||
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1 | EE | C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu: The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability 43(4): 625-633 (2003) |
1 | M. O. Alam | [1] |
2 | C. Bailey | [1] |
3 | Y. C. Chan | [1] |
4 | Hua Lu | [1] |