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C. Y. Yin

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2003
1EEC. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu: The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability 43(4): 625-633 (2003)

Coauthor Index

1M. O. Alam [1]
2C. Bailey [1]
3Y. C. Chan [1]
4Hua Lu [1]

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