| 2003 |
|---|
| 3 | EE | Y. Deshayes,
L. Béchou,
J.-Y. Delétage,
F. Verdier,
Y. Danto,
D. Laffitte,
J. L. Goudard:
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules.
Microelectronics Reliability 43(7): 1125-1136 (2003) |
| 2 | EE | J.-Y. Delétage,
F. J.-M. Verdier,
B. Plano,
Y. Deshayes,
L. Béchou,
Y. Danto:
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations.
Microelectronics Reliability 43(7): 1137-1144 (2003) |
| 1 | EE | A. Tetelin,
C. Pellet,
J.-Y. Delétage,
B. Carbonne,
Y. Danto:
Moisture diffusion in BCB resins used for MEMS packaging.
Microelectronics Reliability 43(9-11): 1939-1944 (2003) |
