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2003 | ||
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2 | EE | M. Zecri, P. Besse, P. Givelin, M. Nayrolles, M. Bafleur, N. Nolhier: Determination of the ESD Failure Cause Through its Signature. Microelectronics Reliability 43(9-11): 1551-1556 (2003) |
2002 | ||
1 | EE | O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi: Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability 42(7): 1053-1058 (2002) |
1 | M. Bafleur | [2] |
2 | P. Besse | [2] |
3 | Y. S. Chung | [1] |
4 | J. M. Dorkel | [1] |
5 | P. Givelin | [2] |
6 | M. Nayrolles | [2] |
7 | N. Nolhier | [2] |
8 | O. Perat | [1] |
9 | A. Peyre-Lavigne | [1] |
10 | E. Scheid | [1] |
11 | Pierre Temple-Boyer | [1] |
12 | P. Tounsi | [1] |