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| 2003 | ||
|---|---|---|
| 2 | EE | M. Zecri, P. Besse, P. Givelin, M. Nayrolles, M. Bafleur, N. Nolhier: Determination of the ESD Failure Cause Through its Signature. Microelectronics Reliability 43(9-11): 1551-1556 (2003) |
| 2002 | ||
| 1 | EE | O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi: Characterization method of thermomechanical parameters for microelectronic materials. Microelectronics Reliability 42(7): 1053-1058 (2002) |
| 1 | M. Bafleur | [2] |
| 2 | P. Besse | [2] |
| 3 | Y. S. Chung | [1] |
| 4 | J. M. Dorkel | [1] |
| 5 | P. Givelin | [2] |
| 6 | M. Nayrolles | [2] |
| 7 | N. Nolhier | [2] |
| 8 | O. Perat | [1] |
| 9 | A. Peyre-Lavigne | [1] |
| 10 | E. Scheid | [1] |
| 11 | Pierre Temple-Boyer | [1] |
| 12 | P. Tounsi | [1] |