| |
| 2003 | ||
|---|---|---|
| 1 | EE | Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, Manabu Bonkohara: Ultra-high-density interconnection technology of three-dimensional packaging. Microelectronics Reliability 43(8): 1267-1279 (2003) |
| 1 | Manabu Bonkohara | [1] |
| 2 | Yoshihiko Nemoto | [1] |
| 3 | Masamoto Tago | [1] |
| 4 | Kenji Takahashi | [1] |
| 5 | Naotaka Tanaka | [1] |
| 6 | Kazumasa Tanida | [1] |
| 7 | Mitsuo Umemoto | [1] |