| 2005 |
|---|
| 4 | EE | Y. F. Yao,
B. Njoman,
K. H. Chua,
T. Y. Lin:
New encapsulation development for fine pitch IC devices.
Microelectronics Reliability 45(7-8): 1222-1229 (2005) |
| 2003 |
|---|
| 3 | EE | Y. F. Yao,
T. Y. Lin,
K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP).
Microelectronics Reliability 43(12): 2039-2045 (2003) |
| 2 | EE | T. Y. Lin,
K. L. Davison,
W. S. Leong,
Simon Chua,
Y. F. Yao,
J. S. Pan,
J. W. Chai,
K. C. Toh,
W. C. Tjiu:
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.
Microelectronics Reliability 43(5): 803-809 (2003) |
| 1 | EE | T. Y. Lin,
C. M. Fang,
Y. F. Yao,
K. H. Chua:
Development of the green plastic encapsulation for high density wirebonded leaded packages.
Microelectronics Reliability 43(5): 811-817 (2003) |
