| |
| 2003 | ||
|---|---|---|
| 1 | EE | Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung: Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectronics Reliability 43(6): 925-934 (2003) |
| 1 | S. C. Hung | [1] |
| 2 | J. Z. Lee | [1] |
| 3 | K. H. Liu | [1] |
| 4 | J. D. Wu | [1] |