C. M. Fang

2003
1	EE	T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua: Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability 43(5): 811-817 (2003)

Coauthor Index

1	K. H. Chua	[1]
2	T. Y. Lin	[1]
3	Y. F. Yao	[1]