N. Y. A. Shammas

2003
3	EE	N. Y. A. Shammas: Present problems of power module packaging technology. Microelectronics Reliability 43(4): 519-527 (2003)
2002
2	EE	N. Y. A. Shammas, M. P. Rodriguez, F. Masana: A simple method for evaluating the transient thermal response of semiconductor devices. Microelectronics Reliability 42(1): 109-117 (2002)
2001
1	EE	M. P. Rodriguez, N. Y. A. Shammas: Finite element simulation of thermal fatigue in multilayer structures: thermal and mechanical approach. Microelectronics Reliability 41(4): 517-523 (2001)

Coauthor Index

1	F. Masana	[2]
2	M. P. Rodriguez	[1] [2]