W. C. Tjiu

2003
1	EE	T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu: Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectronics Reliability 43(5): 803-809 (2003)

Coauthor Index

1	J. W. Chai	[1]
2	Simon Chua	[1]
3	K. L. Davison	[1]
4	W. S. Leong	[1]
5	T. Y. Lin	[1]
6	J. S. Pan	[1]
7	K. C. Toh	[1]
8	Y. F. Yao	[1]