| 2003 |
|---|
| 2 | EE | T. Y. Lin,
K. L. Davison,
W. S. Leong,
Simon Chua,
Y. F. Yao,
J. S. Pan,
J. W. Chai,
K. C. Toh,
W. C. Tjiu:
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.
Microelectronics Reliability 43(5): 803-809 (2003) |
| 2002 |
|---|
| 1 | EE | T. Y. Lin,
W. S. Leong,
K. H. Chua,
R. Oh,
Y. Miao,
J. S. Pan,
J. W. Chai:
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.
Microelectronics Reliability 42(3): 375-380 (2002) |
