F. Speroni

2003
2	EE	A. Andreini, C. Neva, L. Renard, G. Sironi, F. Speroni, L. Sponton, F. Tampellini, R. Tiziani: Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections. Microelectronics Reliability 43(9-11): 1377-1382 (2003)
2002
1	EE	G. Scandurra, C. Ciofi, C. Pace, F. Speroni, F. Alagi: True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines. Microelectronics Reliability 42(9-11): 1347-1351 (2002)

Coauthor Index

1	F. Alagi	[1]
2	A. Andreini	[2]
3	C. Ciofi	[1]
4	C. Neva	[2]
5	C. Pace	[1]
6	L. Renard	[2]
7	G. Scandurra	[1]
8	G. Sironi	[2]
9	L. Sponton	[2]
10	F. Tampellini	[2]
11	R. Tiziani	[2]

Colors in the list of coauthors