| |
| 2003 | ||
|---|---|---|
| 2 | EE | Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong: Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. Microelectronics Reliability 43(5): 741-749 (2003) |
| 1 | EE | Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong: Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. Microelectronics Reliability 43(7): 1117-1123 (2003) |
| 1 | Chek Lim Kho | [2] |
| 2 | Hun Shen Ng | [1] |
| 3 | Tong Yan Tee | [1] [2] |
| 4 | Carol Toh | [2] |
| 5 | Daniel Yap | [1] [2] |
| 6 | Zhaowei Zhong | [1] [2] |