| 2006 |
|---|
| 6 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
T. Webers,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Analysis and modeling of power grid transmission lines.
DATE 2006: 33-38 |
| 5 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
Walter De Raedt,
Eric Beyne,
M. Kuijk,
Bart Nauwelaers:
Constant Impedance Scaling Paradigm for Scaling LC transmission lines.
ISQED 2006: 387-392 |
| 4 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
M. Kuijk,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Constant impedance scaling paradigm for interconnect synthesis.
SLIP 2006: 99-105 |
| 3 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
M. Kuijk,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Wafer-level package interconnect options.
IEEE Trans. VLSI Syst. 14(6): 654-659 (2006) |
| 2005 |
|---|
| 2 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
T. Webers,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Package level interconnect options.
SLIP 2005: 21-27 |
| 2003 |
|---|
| 1 | EE | Arun Chandrasekhar,
Steven Brebels,
Serguei Stoukatch,
Eric Beyne,
Walter De Raedt,
Bart Nauwelaers:
The influence of packaging materials on RF performance.
Microelectronics Reliability 43(3): 351-357 (2003) |
