| 2006 |
|---|
| 4 | EE | K. S. Kim,
C. H. Yu,
J. M. Yang:
Tin whisker formation of lead-free plated leadframes.
Microelectronics Reliability 46(7): 1080-1086 (2006) |
| 2005 |
|---|
| 3 | EE | K. S. Kim,
K. W. Ryu,
C. H. Yu,
J. M. Kim:
The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces.
Microelectronics Reliability 45(3-4): 647-655 (2005) |
| 2004 |
|---|
| 2 | EE | K. S. Kim,
H. I. Kim,
C. H. Yu,
E. G. Chang:
Fatigue analysis of high-speed photodiode submodule by using FEM.
Microelectronics Reliability 44(1): 167-171 (2004) |
| 2003 |
|---|
| 1 | EE | K. S. Kim,
C. H. Yu,
N. H. Kim,
N. K. Kim,
H. J. Chang,
E. G. Chang:
Isothermal aging characteristics of Sn-Pb micro solder bumps.
Microelectronics Reliability 43(5): 757-763 (2003) |
