Volume 46,
Number 1,
January 2006
Invited Papers
- V. Huard, M. Denais, C. R. Parthasarathy:
NBTI degradation: From physical mechanisms to modelling.
1-23
Electronic Edition (link) BibTeX
- Y. C. Chou, D. Leung, R. Grundbacher, R. Lai, Q. Kan, P. H. Liu, D. Eng, T. Block, A. Oki:
Gate metal interdiffusion induced degradation in space-qualified GaAs PHEMTs.
24-40
Electronic Edition (link) BibTeX
- J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee:
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.
41-52
Electronic Edition (link) BibTeX
- Michael Pecht, Yuliang Deng:
Electronic device encapsulation using red phosphorus flame retardants.
53-62
Electronic Edition (link) BibTeX
- M. Agostinelli, S. Lau, S. Pae, P. Marzolf, H. Muthali, S. Jacobs:
PMOS NBTI-induced circuit mismatch in advanced technologies.
63-68
Electronic Edition (link) BibTeX
Research Papers
- S. Chatterjee, Yue Kuo, J. Lu, J.-Y. Tewg, P. Majhi:
Electrical reliability aspects of HfO2 high-k gate dielectrics with TaN metal gate electrodes under constant voltage stress.
69-76
Electronic Edition (link) BibTeX
- Bradford L. Hunter, Brian K. Butka:
Damped transient power clamps for improved ESD protection of CMOS.
77-85
Electronic Edition (link) BibTeX
- Hamid R. Zarandi, Seyed Ghassem Miremadi:
A fault-tolerant cache architecture based on binary set partitioning.
86-99
Electronic Edition (link) BibTeX
- Hyong Tae Kim, Chang Seop Song, Hae Jeong Yang:
Algorithm for automatic alignment in 2D space by object transformation.
100-108
Electronic Edition (link) BibTeX
- Jaroslaw Legierski, Boguslaw Wiecek, Gilbert De Mey:
Measurements and simulations of transient characteristics of heat pipes.
109-115
Electronic Edition (link) BibTeX
- Z. Radivojevic, I. Kassamakov, M. Oinonen, H. Saarikko, H. Seppanen, P. Vihinen:
Transient IR imaging of light and flexible microelectronic devices.
116-123
Electronic Edition (link) BibTeX
- Amir Rajabzadeh, Seyed Ghassem Miremadi:
Transient detection in COTS processors using software approach.
124-133
Electronic Edition (link) BibTeX
- M. Matters-Kammerer, U. Mackens, K. Reimann, R. Pietig, D. Hennings, B. Schreinemacher, R. Mauczok, S. Gruhlke, C. Martiny:
Material properties and RF applications of high k and ferrite LTCC ceramics.
134-143
Electronic Edition (link) BibTeX
- T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl:
High-temperature reliability of Flip Chip assemblies.
144-154
Electronic Edition (link) BibTeX
- K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai:
Effects of underfill materials on the reliability of low-K flip-chip packaging.
155-163
Electronic Edition (link) BibTeX
Research Notes
- Yao Zhao, Mingzhen Xu, Changhua Tan:
Effect of reverse substrate bias on ultra-thin gate oxide n-MOSFET degradation under different stress modes.
164-168
Electronic Edition (link) BibTeX
- A. Caddemi, G. Crupi, N. Donato:
Temperature effects on DC and small signal RF performance of AlGaAs/GaAs HEMTs.
169-173
Electronic Edition (link) BibTeX
- B. Vermeersch, Gilbert De Mey:
Thermal impedance plots of micro-scaled devices.
174-177
Electronic Edition (link) BibTeX
- J. F. Luo, Y. Ji, T. X. Zhong, Y. Q. Zhang, J. Z. Wang, J. P. Liu, N. H. Niu, J. Han, X. Guo, G. D. Shen:
EBSD measurements of elastic strain fields in a GaN/sapphire structure.
178-182
Electronic Edition (link) BibTeX
- Jung-Hyuk Koh, Tae-geun Kim:
Reliability of Pb(Mg, Nb)O3-Pb(Zr, Ti)O3 multilayer ceramic piezoelectric actuators by Weibull method.
183-188
Electronic Edition (link) BibTeX
- Andrzej Szymanski, Ewa Kurjata-Pfitzner:
Effects of package and process variation on 2.4GHz analog integrated circuits.
189-193
Electronic Edition (link) BibTeX
Book Reviews
- Mile K. Stojcev:
Stephen Brown Zvonko Vranesic, Fundamental of Digital Logic with Verilog Design, McGraw Hill, Boston, 2004, Hardcover, pp 844, plus XX, ISBN 0-07-121359-7.
194-195
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
John P. Hayes, Computer Architecture and Organization, Third ed., McGraw-Hill Book Company, Inc., Boston, 1988, Softcover, pp 604, plus XIV, ISBN 0-07-115997-5.
196-197
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
S. Sutherland, S. Davidman and P. Flake, System Verilog for Design: A Guide to Using System Verilog for Hardware Design and Modeling Hardcover, Kluwer Academic Publishers, Norwell, MA (2004) ISBN 1-4020-7530-8 pp 374, plus XXVIII, euro 119.
198-199
Electronic Edition (link) BibTeX
Volume 46,
Numbers 2-4,
February-April 2006
Invited Papers
- Sasan Naseh, M. Jamal Deen, Chih-Hung Chen:
Hot-carrier reliability of submicron NMOSFETs and integrated NMOS low noise amplifiers.
201-212
Electronic Edition (link) BibTeX
- Chao-Kun Hu, L. Gignac, R. Rosenberg:
Electromigration of Cu/low dielectric constant interconnects.
213-231
Electronic Edition (link) BibTeX
- F. Chen, J. Gill, D. Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, Daniel C. Edelstein:
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.
232-243
Electronic Edition (link) BibTeX
- S. Manian Ramkumar, Reza Ghaffarian, Arun Varanasi:
Lead-free 0201 manufacturing, assembly and reliability test results.
244-262
Electronic Edition (link) BibTeX
- Mitsuo Fukuda:
Optical source reliability in recent optical fiber transmission systems and consumer electronics.
263-269
Electronic Edition (link) BibTeX
- James H. Stathis, S. Zafar:
The negative bias temperature instability in MOS devices: A review.
270-286
Electronic Edition (link) BibTeX
Research Papers
- M. Ossaimee, K. Kirah, W. Fikry, A. Girgis, O. A. Omar:
Simplified quantitative stress-induced leakage current (SILC) model for MOS devices.
287-292
Electronic Edition (link) BibTeX
- Alexander Zemliak, Roque De La Cruz:
Numerical analysis of a double avalanche region IMPATT diode on the basis of nonlinear model.
293-300
Electronic Edition (link) BibTeX
- Kun-Hsien Lin, Ming-Dou Ker:
Electrostatic discharge protection scheme without leakage current path for CMOS IC operating in power-down-mode condition on a system board.
301-310
Electronic Edition (link) BibTeX
- A. T. Hatzopoulos, D. H. Tassis, N. Arpatzanis, C. A. Dimitriadis, G. Kamarinos:
Effects of hot carriers in offset gated polysilicon thin-film transistors.
311-316
Electronic Edition (link) BibTeX
- A. M. Albadri, R. D. Schrimpf, K. F. Galloway, D. G. Walker:
Single event burnout in power diodes: Mechanisms and models.
317-325
Electronic Edition (link) BibTeX
- Mohammadreza Keimasi, Sanka Ganesan, Michael G. Pecht:
Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers.
326-334
Electronic Edition (link) BibTeX
- K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai:
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC.
335-342
Electronic Edition (link) BibTeX
- C. Pramanik, T. Islam, H. Saha:
Temperature compensation of piezoresistive micro-machined porous silicon pressure sensor by ANN.
343-351
Electronic Edition (link) BibTeX
- Andrzej Dziedzic, Andrzej Kolek, Waleed Ehrhardt, Heiko Thust:
Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors.
352-359
Electronic Edition (link) BibTeX
- Sanka Ganesan, Michael G. Pecht, Sharon Ling:
Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices.
360-366
Electronic Edition (link) BibTeX
- Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar:
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition.
367-379
Electronic Edition (link) BibTeX
- Jamil A. Wakil:
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks.
380-385
Electronic Edition (link) BibTeX
- Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang:
Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages.
386-399
Electronic Edition (link) BibTeX
- Daniel N. Donahoe, Michael G. Pecht, Isabel K. Lloyd, Sanka Ganesan:
Moisture induced degradation of multilayer ceramic capacitors.
400-408
Electronic Edition (link) BibTeX
- Y. L. Zhang, D. X. Q. Shi, W. Zhou:
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading.
409-420
Electronic Edition (link) BibTeX
- A. S. Fleischer, U. Troppenz, M. Hamacher, W. John:
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser.
421-431
Electronic Edition (link) BibTeX
- Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi:
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints.
432-439
Electronic Edition (link) BibTeX
- Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang:
Thermal resistance analysis and validation of flip chip PBGA packages.
440-448
Electronic Edition (link) BibTeX
- Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din:
Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process.
449-458
Electronic Edition (link) BibTeX
- YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai:
Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder.
459-466
Electronic Edition (link) BibTeX
- Sarangapani Murali, Narasimalu Srikanth, Charles J. Vath III:
Effect of wire diameter on the thermosonic bond reliability.
467-475
Electronic Edition (link) BibTeX
- M. Y. Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu:
Thermal deformation measurements and predictions of MAP-BGA electronic packages.
476-486
Electronic Edition (link) BibTeX
- Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang:
A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process.
487-495
Electronic Edition (link) BibTeX
- Michael C. Larson, Melody A. Verges, Xia Liu:
Residual compression in area array packages induced by underfill shrinkage.
496-502
Electronic Edition (link) BibTeX
- Jongwoo Park, John Osenbach:
Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging.
503-511
Electronic Edition (link) BibTeX
- Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik:
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages.
512-522
Electronic Edition (link) BibTeX
- Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang:
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.
523-534
Electronic Edition (link) BibTeX
- Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung:
Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application.
535-542
Electronic Edition (link) BibTeX
- C. D. Breach, F. Wulff, C. W. Tok:
An unusual mechanical failure mode in gold ballbonds at 50mum pitch due to degradation at the Au-Au4Al interface during ageing in air at 175degreeC.
543-557
Electronic Edition (link) BibTeX
- Yuqi Wang, K. H. Low, H. L. J. Pang, K. H. Hoon, F. X. Che, Y. S. Yong:
Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards.
558-573
Electronic Edition (link) BibTeX
- Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt:
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints.
574-588
Electronic Edition (link) BibTeX
- Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik:
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study.
589-599
Electronic Edition (link) BibTeX
- Fei Su, Kerm Sin Chian, Sung Yi:
An optical characterization technique for hygroscopic expansion of polymers and plastic packages.
600-609
Electronic Edition (link) BibTeX
- Lei Han, Fuliang Wang, Wenhu Xu, Jue Zhong:
Bondability window and power input for wire bonding.
610-615
Electronic Edition (link) BibTeX
- W. Dauksher, P. Marcoux, G. Castleman:
A methodology for the calculation of stress migration in die-level interconnects.
616-625
Electronic Edition (link) BibTeX
- Chang-Lin Yeh, Yi-Shao Lai:
Support excitation scheme for transient analysis of JEDEC board-level drop test.
626-636
Electronic Edition (link) BibTeX
Research Notes
- L. Chen, O. J. Guy, D. Doneddu, S. G. J. Batcup, S. P. Wilks, P. A. Mawby, T. Bouchet, F. Torregrosa:
Report on 4H-SiC JTE Schottky diodes.
637-640
Electronic Edition (link) BibTeX
- V. S. Pershenkov, A. D. Tremasov, V. V. Belyakov, A. U. Razvalyaev, V. S. Mochkin:
X-ray ion mobility spectrometer.
641-644
Electronic Edition (link) BibTeX
- Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh:
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.
645-650
Electronic Edition (link) BibTeX
Book Reviews
- Mile K. Stojcev:
Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, ISBN 1-4020-7671-1, pp 294, plus IX.
651-652
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
Low Power Electronics Design, Christian Pignet, Editor, CRC Press, Boca Raton, 2005, Hardcover, pp 854, plus 18, ISBN 0-8493-1941-2.
653-654
Electronic Edition (link) BibTeX
Volume 46,
Numbers 5-6,
May-June 2006
Special Section:
EOS / ESD Symposium 2004
- Natarajan Mahadeva Iyer:
Introduction to special section on selected papers from EOS/ESD Symposium 2004.
655
Electronic Edition (link) BibTeX
- Charvaka Duvvury, Robert Steinhoff, Gianluca Boselli, Vijay Reddy, Hans Kunz, Steve Marum, Roger Cline:
Gate oxide failures due to anomalous stress from HBM ESD testers.
656-665
Electronic Edition (link) BibTeX
- M. Etherton, N. Qu, J. Willemen, Wolfgang Wilkening, S. Mettler, M. Dissegna, R. Stella, L. Zullino, A. Andreini, Horst A. Gieser:
Study of CDM specific effects for a smart power input protection structure.
666-676
Electronic Edition (link) BibTeX
- Bart Keppens, Markus P. J. Mergens, Cong Son Trinh, Christian C. Russ, Benjamin Van Camp, Koen G. Verhaege:
ESD protection solutions for high voltage technologies.
677-688
Electronic Edition (link) BibTeX
- K. Domanski, B. Póltorak, S. Bargstädt-Franke, Wolfgang Stadler, W. Bala:
Physical fundamentals of external transient latch-up and corrective actions.
689-701
Electronic Edition (link) BibTeX
- S. Thijs, M. Natarajan Iyer, D. Linten, Wutthinan Jeamsaksiri, T. Daenen, Robin Degraeve, Andries Scholten, Stefaan Decoutere, Guido Groeseneken:
Implementation of plug-and-play ESD protection in 5.5GHz 90nm RF CMOS LNAs - Concepts, constraints and solutions.
702-712
Electronic Edition (link) BibTeX
Introductory Invited Paper
Research Papers
- F. J. García Sánchez, Adelmo Ortiz-Conde, J. Muci:
Understanding threshold voltage in undoped-body MOSFETs: An appraisal of various criteria.
731-742
Electronic Edition (link) BibTeX
- Maciej Wolborski, Mietek Bakowski, Armando Ortiz, Viljami Pore, Adolf Schöner, Mikko Ritala, Markku Leskelä, Anders Hallén:
Characterisation of the Al2O3 films deposited by ultrasonic spray pyrolysis and atomic layer deposition methods for passivation of 4H-SiC devices.
743-755
Electronic Edition (link) BibTeX
- Takayoshi Katahira, Ilkka Kartio, Hiroshi Segawa, Michimasa Takahashi, Katsumi Sagisaka:
Vertically high-density interconnection for mobile application.
756-762
Electronic Edition (link) BibTeX
- M. Y. Pan, M. Gupta, A. A. O. Tay, K. Vaidyanathan:
Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging.
763-767
Electronic Edition (link) BibTeX
- Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel:
Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems.
768-773
Electronic Edition (link) BibTeX
- Xu Chen, Jun Zhang, Chunlei Jiao, Yanmin Liu:
Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection.
774-785
Electronic Edition (link) BibTeX
- Y. Guhel, B. Boudart, E. Delos, M. Germain, Z. Bougrioua:
Comparative studies of Pt and Ir schottky contacts on undoped Al0.36Ga0.64N.
786-793
Electronic Edition (link) BibTeX
- Amy S. Fleischer, Li-hsin Chang, Barry C. Johnson:
The effect of die attach voiding on the thermal resistance of chip level packages.
794-804
Electronic Edition (link) BibTeX
- Zunxian Yang, Ying Yu, Xinxin Li, Haifei Bao:
Nano-mechanical electro-thermal probe array used for high-density storage based on NEMS technology.
805-810
Electronic Edition (link) BibTeX
- Guang-Ming Zhang, David M. Harvey, Derek R. Braden:
Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection.
811-821
Electronic Edition (link) BibTeX
- W. Dreyer, F. Duderstadt, S. Eichler, M. Jurisch:
Stress analysis and bending tests for GaAs wafers.
822-835
Electronic Edition (link) BibTeX
- Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar:
Effect of wafer thinning methods towards fracture strength and topography of silicon die.
836-845
Electronic Edition (link) BibTeX
- Tong Fang, Michael D. Osterman, Michael G. Pecht:
Statistical analysis of tin whisker growth.
846-849
Electronic Edition (link) BibTeX
- M. Yamashita, K. Suganuma:
Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers.
850-858
Electronic Edition (link) BibTeX
- Yi-Shao Lai:
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials.
859-863
Electronic Edition (link) BibTeX
- Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong:
A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qeta.
864-872
Electronic Edition (link) BibTeX
- H. R. Ghorbani, J. K. Spelt:
Interfacial thermal stresses in solder joints of leadless chip resistors.
873-884
Electronic Edition (link) BibTeX
- Chang-Lin Yeh, Yi-Shao Lai:
Transient fracturing of solder joints subjected to displacement-controlled impact loads.
885-895
Electronic Edition (link) BibTeX
- W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna:
Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders.
896-904
Electronic Edition (link) BibTeX
- Jeong-Won Yoon, Seung-Boo Jung:
High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging.
905-914
Electronic Edition (link) BibTeX
- Yi-Shao Lai, Chin-Li Kao:
Characteristics of current crowding in flip-chip solder bumps.
915-922
Electronic Edition (link) BibTeX
- Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto:
Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device.
923-929
Electronic Edition (link) BibTeX
- E. H. Wong, Y.-W. Mai:
New insights into board level drop impact.
930-938
Electronic Edition (link) BibTeX
- Cher Ming Tan, Zhenghao Gan, Tai Chong Chai:
Feasibility study of the application of voltage contrast to printed circuit board.
939-948
Electronic Edition (link) BibTeX
- A. Dabrowski, Rafal Dlugosz, P. Pawlowski:
Integrated CMOS GSM baseband channel selecting filters realized using switched capacitor finite impulse response technique.
949-958
Electronic Edition (link) BibTeX
- Amir Rajabzadeh, Seyed Ghassem Miremadi:
CFCET: A hardware-based control flow checking technique in COTS processors using execution tracing.
959-972
Electronic Edition (link) BibTeX
- Jing Lee:
A reliability-driven placement procedure based on thermal-force model.
973-983
Electronic Edition (link) BibTeX
- J. Jilesen, F. S. Lien, H. Ahn:
Investigation of increased performance of close series stacked tube axial fans due to inclusion of diffuser element.
984-993
Electronic Edition (link) BibTeX
Research Notes
- H. Maanane, M. Masmoudi, J. Marcon, M. A. Belaïd, K. Mourgues, C. Tolant, K. Ketata, Ph. Eudeline:
Study of RF N- LDMOS critical electrical parameter drifts after a thermal and electrical ageing in pulsed RF.
994-1000
Electronic Edition (link) BibTeX
- Zhilin Sun, Weifeng Sun, Yangbo Yi, Longxing Shi:
Study of the power capability of LDMOS and the improved methods.
1001-1005
Electronic Edition (link) BibTeX
- H. Y. Kang, A. H. I. Lee:
Critical dimension control in photolithography based on the yield by a simulation program.
1006-1012
Electronic Edition (link) BibTeX
- B. Foucher, J. Tomas, F. Mounsi, M. Jeremias:
Life margin assessment with Physics of Failure Tools application to BGA packages.
1013-1018
Electronic Edition (link) BibTeX
- Krystyna Siekierska, Pawel Fras, Artur Kokoszka, Tomasz Kostienko, Norbert Lugowski, Dariusz Obrebski, Adam Pawlak, Piotr Penkala, Dariusz Stachanczyk, Marek Szlezak:
Distributed collaborative design of IP components in the TRMS environment.
1019-1024
Electronic Edition (link) BibTeX
Book Review
- Mile K. Stojcev:
F. Mayer-Linderberg, Dedicated Digital Processors: Methods in Hardware/Software System Design, John Wiley & Sons, Ltd., Chichester (2004) ISBN 0-470-84444-2 Hardcover, pp 302, plus XI.
1025-1026
Electronic Edition (link) BibTeX
Volume 46,
Number 7,
July 2006
Research papers
- V. Filip, Hei Wong, D. Nicolaescu:
Definition of curve fitting parameter to study tunneling and trapping of electrons in Si/ultra-thin SiO2/metal structures.
1027-1034
Electronic Edition (link) BibTeX
- S. E. Tyaginov, M. I. Vexler, A. F. Shulekin, I. V. Grekhov:
The post-damage behavior of a MOS tunnel emitter transistor.
1035-1041
Electronic Edition (link) BibTeX
- Shih-Hung Chen, Ming-Dou Ker:
Failure analysis and solutions to overcome latchup failure event of a power controller IC in bulk CMOS technology.
1042-1049
Electronic Edition (link) BibTeX
- A. Emre Yarimbiyik, Harry A. Schafft, Richard A. Allen, Mona E. Zaghloul, David L. Blackburn:
Modeling and simulation of resistivity of nanometer scale copper.
1050-1057
Electronic Edition (link) BibTeX
- Henry Y. Lu, Haluk Balkan, K. Y. Simon Ng:
Microstructure evolution of the Sn-Ag-y%Cu interconnect.
1058-1070
Electronic Edition (link) BibTeX
- Päivi H. Karjalainen, Eero Ristolainen:
Balancing temperature dependence of on-wafer SOS inductors.
1071-1079
Electronic Edition (link) BibTeX
- K. S. Kim, C. H. Yu, J. M. Yang:
Tin whisker formation of lead-free plated leadframes.
1080-1086
Electronic Edition (link) BibTeX
- Dae Whan Kim, Byung-Seon Kong:
The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump.
1087-1094
Electronic Edition (link) BibTeX
- M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles:
Test structure assembly for bump bond yield measurement on high density flip chip technologies.
1095-1100
Electronic Edition (link) BibTeX
- Yong Ding, Jang-Kyo Kim, Pin Tong:
Effects of bonding force on contact pressure and frictional energy in wire bonding.
1101-1112
Electronic Edition (link) BibTeX
- M. Yamashita, K. Suganuma:
Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure.
1113-1118
Electronic Edition (link) BibTeX
- Dong-Jun Lee, Hyo S. Lee:
Major factors to the solder joint strength of ENIG layer in FC BGA package.
1119-1127
Electronic Edition (link) BibTeX
- Xia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson:
Experimental study and life prediction on high cycle vibration fatigue in BGA packages.
1128-1138
Electronic Edition (link) BibTeX
- Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu:
Stability of the warpage in a PBGA package subjected to hygro-thermal loading.
1139-1147
Electronic Edition (link) BibTeX
- Hua Lu, Helen Shi, Ming Zhou:
Thermally induced deformation of solder joints in real packages: Measurement and analysis.
1148-1159
Electronic Edition (link) BibTeX
- Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low:
Drop impact reliability testing for lead-free and lead-based soldered IC packages.
1160-1171
Electronic Edition (link) BibTeX
- Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao:
Evaluation of board-level reliability of electronic packages under consecutive drops.
1172-1182
Electronic Edition (link) BibTeX
- Y. H. Hung, M. L. Huang, C. H. Chang:
Optimizing the controller IC for micro HDD process based on Taguchi methods.
1183-1188
Electronic Edition (link) BibTeX
- K. S. Chen, C. H. Wang, H. T. Chen:
A MAIC approach to TFT-LCD panel quality improvement.
1189-1198
Electronic Edition (link) BibTeX
- Jianhui Xing, Hong Wang, Shiyuan Yang:
Constructing IP cores' transparency paths for SoC test access using greedy search.
1199-1208
Electronic Edition (link) BibTeX
Research note
Book review
- Mile K. Stojcev:
R. Jacob Baker, CMOS Circuit Design, Layout, and Simulation (second ed.), Wiley Interscience & IEEE Press (2005) ISBN 0-471-70055-X Hardcover, pp 1039, plus XXXIII.
1214-1215
Electronic Edition (link) BibTeX
Volume 46,
Number 8,
August 2006
Microelectronic Reliability :
2005 ROCS Workshop
- Peter Ersland, Roberto Menozzi:
Editorial.
1217
Electronic Edition (link) BibTeX
- William J. Roesch:
Historical review of compound semiconductor reliability.
1218-1227
Electronic Edition (link) BibTeX
- Charles S. Whitman, Terri M. Gilbert, Ann M. Rahn, Jennifer A. Antonell:
Determining factors affecting ESD failure voltage using DOE.
1228-1237
Electronic Edition (link) BibTeX
- William J. Roesch:
Compound semiconductor activation energy in humidity.
1238-1246
Electronic Edition (link) BibTeX
- S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. Therrien, J. W. Johnson, W. Nagy, J. Marquart, P. Rajagopal, J. C. Roberts:
Reliability of large periphery GaN-on-Si HFETs.
1247-1253
Electronic Edition (link) BibTeX
- Shivarajiv Somisetty, Peter Ersland, Xinxing Yang, Jason Barrett:
Reliability investigation and characterization of failure modes in Schottky diodes.
1254-1260
Electronic Edition (link) BibTeX
- Charles S. Whitman:
Reliability results of HBTs with an InGaP emitter.
1261-1271
Electronic Edition (link) BibTeX
- Craig Gaw, Thomas Arnold, Robert Martin, Lisa Zhang, Dragan Zupac:
Evaluation of SiGe: C HBT intrinsic reliability using conventional and step stress methodologies.
1272-1278
Electronic Edition (link) BibTeX
- P. J. van der Wel, S. J. C. H. Theeuwen, J. A. Bielen, Y. Li, R. A. van den Heuvel, J. G. Gommans, F. van Rijs, P. Bron, H. J. F. Peuscher:
Wear out failure mechanisms in aluminium and gold based LDMOS RF power applications.
1279-1284
Electronic Edition (link) BibTeX
Research Papers
- Javier A. Salcedo, Juin J. Liou, Muhammad Yaqub Afridi, Allen R. Hefner:
On-chip electrostatic discharge protection for CMOS gas sensor systems-on-a-chip (SoC).
1285-1294
Electronic Edition (link) BibTeX
- A. Kumta, Rusli, Chin-Che Tin, J. Ahn:
Design of field-plate terminated 4H-SiC Schottky diodes using high-k dielectrics.
1295-1302
Electronic Edition (link) BibTeX
- A. A. Dakhel:
Study of dc conduction mechanisms in dysprosium-manganese oxide insulator thin films grown on Si substrates.
1303-1308
Electronic Edition (link) BibTeX
- H. S. Nguyen, Z. H. Gan, Zhe Chen, V. Chandrasekar, K. Prasad, S. G. Mhaisalkar, Ning Jiang:
Reliability studies of barrier layers for Cu/PAE low-k interconnects.
1309-1314
Electronic Edition (link) BibTeX
- Petar Ratchev, Serguei Stoukatch, Bart Swinnen:
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads.
1315-1325
Electronic Edition (link) BibTeX
- Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang:
Design of a novel chip on glass package solution for CMOS image sensor device.
1326-1334
Electronic Edition (link) BibTeX
- T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, J. Vähäkangas:
Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies.
1335-1347
Electronic Edition (link) BibTeX
- H. T. Chen, C. Q. Wang, M. Y. Li:
Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling.
1348-1356
Electronic Edition (link) BibTeX
- Yi-Shao Lai, Chin-Li Kao:
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages.
1357-1368
Electronic Edition (link) BibTeX
- C. T. Pan, P. J. Cheng, C. K. Yen, C. C. Hsieh:
Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet.
1369-1381
Electronic Edition (link) BibTeX
- Vanco B. Litovski, Miona Andrejevic, Mark Zwolinski:
Analogue electronic circuit diagnosis based on ANNs.
1382-1391
Electronic Edition (link) BibTeX
Research Note
Book reviews
- Mile K. Stojcev:
Alfredo Benso, Paolo Prinetto, editors, Fault injection techniques and tools for embedded systems reliability and evaluation, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp 241, plus XIV, ISBN 1-4020-7589-8.
1396-1397
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
Sachin Sapatnekar, Timing, Kluwer Academic Publishers, Hardcover, pp 294, plus IX, ISBN 1-4020-7671-1.
1398-1399
Electronic Edition (link) BibTeX
Volume 46,
Numbers 9-11,
September-November 2006
Proceedings of the 17th European Symposium on Reliability of Electron Devices,
Failure Physics and Analysis. Wuppertal,
Germany 3rd-6th October 2006
Keynote
Best paper of Japanese RCJ Reliability Symposium
Topic A:
Reliability for Transportation
- Mogens Blanke, Jesper Sandberg Thomsen:
Electrical steering of vehicles - fault-tolerant analysis and design.
1421-1432
Electronic Edition (link) BibTeX
- M. Wagner, W. Unger, W. Wondrak:
Part average analysis - A tool for reducing failure rates in automotive electronics.
1433-1438
Electronic Edition (link) BibTeX
- P. Tanduo, L. Cola, S. Testa, M. Menchise, A. Mervic:
Read disturb in flash memories: reliability case.
1439-1444
Electronic Edition (link) BibTeX
- O. Briat, W. Lajnef, J.-M. Vinassa, E. Woirgard:
Power cycling tests for accelerated ageing of ultracapacitors.
1445-1450
Electronic Edition (link) BibTeX
- S. Charruau, F. Guerin, J. Hernández Dominguez, J. Berthon:
Reliability estimation of aeronautic component by accelerated tests.
1451-1457
Electronic Edition (link) BibTeX
- Liming Gao, Christian Burmer, Frank Siegelin:
ATPG scan logic failure analysis: a case study of logic ICs - fault isolation, defect mechanism identification and yield improvement.
1458-1463
Electronic Edition (link) BibTeX
Topic B:
Physical Modeling and Simulation for Reliability Prediction
- C. R. Parthasarathy, M. Denais, V. Huard, G. Ribes, D. Roy, C. Guérin, F. Perrier, E. Vincent, A. Bravaix:
Designing in reliability in advanced CMOS technologies.
1464-1471
Electronic Edition (link) BibTeX
- R. L. J. M. Ubachs, O. van der Sluis, W. D. van Driel, G. Q. Zhang:
Multiscale modelling of multilayer substrates.
1472-1477
Electronic Edition (link) BibTeX
- A. Chimenton, F. Irrera, P. Olivo:
Improving performance and reliability of NOR-Flash arrays by using pulsed operation.
1478-1481
Electronic Edition (link) BibTeX
- Christophe Entringer, Philippe Flatresse, Philippe Galy, Florence Azaïs, Pascal Nouet:
Electro-thermal short pulsed simulation for SOI technology.
1482-1485
Electronic Edition (link) BibTeX
Topic C:
Advanced Failure Analysis:
Defect Detection and Analysis
- Christian Burmer, Siegfried Görlich:
Failure analyses for debug and ramp-up of modern IC's.
1486-1497
Electronic Edition (link) BibTeX
- Rudolf Schlangen, Peter Sadewater, Uwe Kerst, Christian Boit:
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node.
1498-1503
Electronic Edition (link) BibTeX
- Radu Ispasoiu, Tom Crawford, Brian Johnston, Chris Shaw, Steven Kasapi, Jason Goertz, Olivier Rinaudo, Peter Ouimet:
Reduction of the acquisition time for CMOS time-resolved photon emission by optimized IR detection.
1504-1507
Electronic Edition (link) BibTeX
- O. Breitenstein, F. Altmann, T. Riediger, D. Karg, V. Gottschalk:
Lock-in thermal IR imaging using a solid immersion lens.
1508-1513
Electronic Edition (link) BibTeX
- A. Douin, V. Pouget, M. De Matos, D. Lewis, Philippe Perdu, P. Fouillat:
Time resolved imaging using synchronous picosecond Photoelectric Laser Stimulation.
1514-1519
Electronic Edition (link) BibTeX
- J. M. Rampnoux, H. Michel, M. Amine Salhi, Stéphane Grauby, Wilfrid Claeys, Stefan Dilhaire:
Time gating imaging through thick silicon substrate: a new step towards backside characterisation.
1520-1524
Electronic Edition (link) BibTeX
- A. Altes, R. Tilgner, W. Walter:
Numerical evaluation of miniaturized resistive probe for quantitative thermal near-field microscopy of thermal conductivity.
1525-1529
Electronic Edition (link) BibTeX
- S. Courtas, M. Grégoire, X. Federspiel, N. Bicaïs-Lépinay, C. Wyon:
Electron BackScattered Diffraction (EBSD) use and applications in newest technologies development.
1530-1535
Electronic Edition (link) BibTeX
- Marco Buzzo, Mauro Ciappa, Wolfgang Fichtner:
Characterization of photonic devices by secondary electron potential contrast.
1536-1541
Electronic Edition (link) BibTeX
- Yasunori Goto, Tomokatsu Higuchi:
A 3D analysis technique for detecting trace metal contamination.
1542-1547
Electronic Edition (link) BibTeX
- R. A. Nicholson, H. Suri:
Physical-to-Logical Mapping of Emission Data using Place-and-Route.
1548-1553
Electronic Edition (link) BibTeX
- N. Rodriguez, J. Adrian, C. Grosjean, G. Haller, C. Girardeaux, A. Portavoce:
Evaluation of scanning capacitance microscopy sample preparation by focused ion beam.
1554-1557
Electronic Edition (link) BibTeX
- Zhongling Qian, Frank Siegelin, Birgit Tippelt, Stefan Müller:
Localization and physical analysis of a complex SRAM failure in 90nm technology.
1558-1562
Electronic Edition (link) BibTeX
- F. Essely, F. Darracq, V. Pouget, M. Remmach, Felix Beaudoin, N. Guitard, M. Bafleur, Philippe Perdu, A. Touboul, D. Lewis:
Application of various optical techniques for ESD defect localization.
1563-1568
Electronic Edition (link) BibTeX
- C. De Nardi, Romain Desplats, Philippe Perdu, J.-L. Gauffier, C. Guérin:
Descrambling and data reading techniques for flash-EEPROM memories. Application to smart cards.
1569-1574
Electronic Edition (link) BibTeX
- M. Sanada, Y. Yoshizawa:
Fault diagnosis technology based on transistor behavior analysis for physical analysis.
1575-1580
Electronic Edition (link) BibTeX
Topic D:
Failure Mechanisms in New Materials and Transistors
- A. S. Oates, S. C. Lee:
Electromigration failure distributions of dual damascene Cu /low - k interconnects.
1581-1586
Electronic Edition (link) BibTeX
- Heinrich Wolf, Horst A. Gieser, Detlef Bonfert, Markus Hauser:
ESD Susceptibility of Submicron Air Gaps.
1587-1590
Electronic Edition (link) BibTeX
- M. Heer, V. Dubec, Scrgey Bychikhin, Dionyz Pogany, E. Gornik, M. Frank, A. Konrad, J. Schulz:
Analysis of triggering behaviour of high voltage CMOS LDMOS clamps and SCRs during ESD induced latch-up.
1591-1596
Electronic Edition (link) BibTeX
- D. Alvarez, M. J. Abou-Khalil, C. Russ, Kiran V. Chatty, Robert Gauthier, D. Kontos, J. Li, C. Seguin, R. Halbach:
Analysis of ESD failure mechanism in 65nm bulk CMOS ESD NMOSFETs with ESD implant.
1597-1602
Electronic Edition (link) BibTeX
- T. Pompl, A. Kerber, M. Röhner, M. Kerber:
Gate voltage and oxide thickness dependence of progressive wear-out of ultra-thin gate oxides.
1603-1607
Electronic Edition (link) BibTeX
- R. Fernández, R. Rodríguez, M. Nafría, X. Aymerich, Ben Kaczer, Guido Groeseneken:
FinFET and MOSFET preliminary comparison of gate oxide reliability.
1608-1611
Electronic Edition (link) BibTeX
- Tze Wee Chen, Choshu Ito, William Loh, Robert W. Dutton:
Post-breakdown leakage resistance and its dependence on device area.
1612-1616
Electronic Edition (link) BibTeX
- Cora Salm, A. J. Hof, Fred G. Kuper, J. Schmitz:
Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs.
1617-1622
Electronic Edition (link) BibTeX
- Gerald Lucovsky, H. Seo, L. B. Fleming, M. D. Ulrich, J. Lüning, Patrick Lysaght, Gennadi Bersuker:
Intrinsic bonding defects in transition metal elemental oxides.
1623-1628
Electronic Edition (link) BibTeX
- Detlef Bonfert, Horst A. Gieser, Heinrich Wolf, M. Frank, A. Konrad, J. Schulz:
Transient-induced latch-up test setup for wafer-level and package-level.
1629-1633
Electronic Edition (link) BibTeX
- J. T. Jang, Y. C. Kim, W. H. Bong, E. K. Kwon, B. J. Kwon, J. S. Jeon, H. G. Kim, I. H. Son:
A new high-voltage tolerant I/O for improving ESD robustness.
1634-1637
Electronic Edition (link) BibTeX
- Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low:
Development of highly accelerated electromigration test.
1638-1642
Electronic Edition (link) BibTeX
- J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger:
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics.
1643-1647
Electronic Edition (link) BibTeX
- M. Goroll, W. Kanert, R. Pufall:
ESD protection structure qualification - a new approach for release for automotive applications.
1648-1651
Electronic Edition (link) BibTeX
- Arijit Roy, Cher Ming Tan:
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
1652-1656
Electronic Edition (link) BibTeX
- J. M. Rafí, E. Simoen, K. Hayama, A. Mercha, F. Campabadal, H. Ohyama, C. Claeys:
Hot-carrier-induced degradation of drain current hysteresis and transients in thin gate oxide floating body partially depleted SOI nMOSFETs.
1657-1663
Electronic Edition (link) BibTeX
- Kyoung-Sik Im, Jae-Hyok Ko, Suk-Jin Kim, Chan-Hee Jeon, Chang-Su Kim, Ki-Tae Lee, Han-Gu Kim, Il-Hun Son:
Novel ESD strategy for high voltage non-volatile programming pin application.
1664-1668
Electronic Edition (link) BibTeX
- Simone Gerardin, A. Griffoni, A. Cester, Alessandro Paccagnella, G. Ghidini:
Degradation of static and dynamic behavior of CMOS inverters during constant and pulsed voltage stress.
1669-1672
Electronic Edition (link) BibTeX
- Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao:
A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect.
1673-1678
Electronic Edition (link) BibTeX
- C. Yuan, W. D. van Driel, R. B. R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
1679-1684
Electronic Edition (link) BibTeX
Topic E:
Reliability of MEMS
- B. Wunderle, B. Michel:
Progress in reliability research in the micro and nano region.
1685-1694
Electronic Edition (link) BibTeX
- M. Exarchos, E. Papandreou, P. Pons, M. Lamhamdi, G. J. Papaioannou, R. Plana:
Charging of radiation induced defects in RF MEMS dielectric films.
1695-1699
Electronic Edition (link) BibTeX
- M. Lamhamdi, J. Guastavino, L. Boudou, Y. Segui, P. Pons, L. Bouscayrol, R. Plana:
Charging-Effects in RF capacitive switches influence of insulating layers composition.
1700-1704
Electronic Edition (link) BibTeX
- C. Palego, A. Pothier, A. Crunteanu, P. Blondy:
High power reliability aspects on RF MEMS varactor design.
1705-1710
Electronic Edition (link) BibTeX
- P. Jacob, A. Kunz, G. Nicoletti:
Reliability and wearout characterisation of LEDs.
1711-1714
Electronic Edition (link) BibTeX
- M. Boutillier, O. Gauthier-Lafaye, S. Bonnefont, F. Lozes-Dupuy, F.-J. Vermersch, M. Krakowski, O. Gilard:
Strong electron irradiation hardness of 852 nm Al-free laser diodes.
1715-1719
Electronic Edition (link) BibTeX
- M. Meneghini, Simona Podda, A. Morelli, Ruggero Pintus, L. Trevisanello, Gaudenzio Meneghesso, Massimo Vanzi, Enrico Zanoni:
High brightness GaN LEDs degradation during dc and pulsed stress.
1720-1724
Electronic Edition (link) BibTeX
- A. Sozza, A. Curutchet, C. Dua, N. Malbert, N. Labat, A. Touboul:
AlGaN/GaN HEMT Reliability Assessment by means of Low Frequency Noise Measurements.
1725-1730
Electronic Edition (link) BibTeX
- K. Hayama, K. Takakura, K. Shigaki, H. Ohyama, J. M. Rafí, A. Mercha, E. Simoen, C. Claeys:
Impact on the back gate degradation in partially depleted SOI n-MOSFETs by 2-MeV electron irradiation.
1731-1735
Electronic Edition (link) BibTeX
- W. Bergbauer, T. Lutz, Werner Frammelsberger, Guenther Benstetter:
Kelvin probe force microscopy - An appropriate tool for the electrical characterisation of LED heterostructures.
1736-1740
Electronic Edition (link) BibTeX
- A. Crunteanu, A. Pothier, P. Blondy, F. Dumas-Bouchiat, C. Champeaux, A. Catherinot, P. Tristant, O. Vendier, C. Drevon, J. L. Cazaux:
Gamma radiation effects on RF MEMS capacitive switches.
1741-1746
Electronic Edition (link) BibTeX
- A. V. Krivosheeva, V. L. Shaposhnikov, V. V. Lyskouski, V. E. Borisenko, F. Arnaud d'Avitaya, J.-L. Lazzari:
Prospects on Mn-doped ZnGeP2 for spintronics.
1747-1749
Electronic Edition (link) BibTeX
- Francesca Danesin, F. Zanon, Simone Gerardin, F. Rampazzo, Gaudenzio Meneghesso, Enrico Zanoni, Alessandro Paccagnella:
Degradation induced by 2-MeV alpha particles on AlGaN/GaN high electron mobility transistors.
1750-1753
Electronic Edition (link) BibTeX
Topic F:
Reliability of High Power Semiconductors
- Alberto Castellazzi, Mauro Ciappa, Wolfgang Fichtner, G. Lourdel, Michel Mermet-Guyennet:
Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications.
1754-1759
Electronic Edition (link) BibTeX
- P. Cova, N. Delmonte, Roberto Menozzi:
Thermal characterization and modeling of power hybrid converters for distributed power systems.
1760-1765
Electronic Edition (link) BibTeX
- L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps:
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling.
1766-1771
Electronic Edition (link) BibTeX
- D. Barlini, Mauro Ciappa, Alberto Castellazzi, Michel Mermet-Guyennet, Wolfgang Fichtner:
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions.
1772-1777
Electronic Edition (link) BibTeX
- A. Benmansour, S. Azzopardi, J. C. Martin, E. Woirgard:
Failure mechanism of trench IGBT under short-circuit after turn-off.
1778-1783
Electronic Edition (link) BibTeX
- A. Irace, G. Breglio, P. Spirito, A. Bricconi, D. Raffo, L. Merlin:
Effect of a buffer layer in the epi-substrate region to boost the avalanche capability of a 100V Schottky diode.
1784-1789
Electronic Edition (link) BibTeX
- F. Iannuzzo, G. Busatto, C. Abbate:
Investigation of MOSFET failure in soft-switching conditions.
1790-1794
Electronic Edition (link) BibTeX
- G. Cassanelli, G. Mura, Fausto Fantini, Massimo Vanzi, B. Plano:
Failure Analysis-assisted FMEA.
1795-1799
Electronic Edition (link) BibTeX
- M. A. Belaïd, K. Ketata, M. Masmoudi, M. Gares, H. Maanane, J. Marcon:
Electrical parameters degradation of power RF LDMOS device after accelerated ageing tests.
1800-1805
Electronic Edition (link) BibTeX
- M. Gares, H. Maanane, M. Masmoudi, P. Bertram, J. Marcon, M. A. Belaïd, K. Mourgues, C. Tolant, Ph. Eudeline:
Hot carrier reliability of RF N- LDMOS for S Band radar application.
1806-1811
Electronic Edition (link) BibTeX
- Chuanzhao Yu, J. S. Yuan, Enjun Xiao:
Dynamic voltage stress effects on nMOS varactor.
1812-1816
Electronic Edition (link) BibTeX
- C. Moreau, P. Le Helleye, D. Ruelloux:
A complete RF power technology assessment for military applications.
1817-1822
Electronic Edition (link) BibTeX
- Guang Yu Huang, Cher Ming Tan:
Device level electrical-thermal-stress coupled-field modeling.
1823-1827
Electronic Edition (link) BibTeX
- D. Dankovic, I. Manic, S. Djoric-Veljkovic, V. Davidovic, S. Golubovic, Ninoslav Stojadinovic:
NBT stress-induced degradation and lifetime estimation in p-channel power VDMOSFETs.
1828-1833
Electronic Edition (link) BibTeX
- X. Perpiñà, J. F. Serviere, J. Saiz, D. Barlini, Michel Mermet-Guyennet, J. Millán:
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current.
1834-1839
Electronic Edition (link) BibTeX
- C. Yu, L. Jiang, J. S. Yuan:
Study of performance degradations in DC-DC converter due to hot carrier stress by simulation.
1840-1843
Electronic Edition (link) BibTeX
- P. Zimprich, T. Licht, B. Weiss:
A new method to characterize the thermomechanical response of multilayered structures in power electronics.
1844-1847
Electronic Edition (link) BibTeX
- C. Abbate, G. Busatto, L. Fratelli, F. Iannuzzo:
The high frequency behaviour of high voltage and current IGBT modules.
1848-1853
Electronic Edition (link) BibTeX
- G. Busatto, F. Iannuzzo, A. Porzio, A. Sanseverino, F. Velardi, G. Currò:
Experimental study of power MOSFET's gate damage in radiation environment.
1854-1857
Electronic Edition (link) BibTeX
- Jingchao Wang, Edgar Olthof, Wim Metselaar:
Hot-carrier degradation analysis based on ring oscillators.
1858-1863
Electronic Edition (link) BibTeX
- In Kyung Lee, Se Re Na Yun, Kyosun Kim, Chong-Gun Yu, Jong-Tae Park:
New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors.
1864-1867
Electronic Edition (link) BibTeX
Topic G:
Packaging and Assembly Reliability
- R. Plieninger, M. Dittes, K. Pressel:
Modern IC packaging trends and their reliability implications.
1868-1873
Electronic Edition (link) BibTeX
- M. C. Yew, C. Y. Chou, C. S. Huang, W. K. Yang, K. N. Chiang:
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis.
1874-1879
Electronic Edition (link) BibTeX
- W. D. van Driel, O. van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang:
Reliability modelling for packages in flexible end-products.
1880-1885
Electronic Edition (link) BibTeX
- W. C. Maia Filho, M. Brizoux, H. Frémont, Y. Danto:
Improved physical understanding of intermittent failure in continuous monitoring method.
1886-1891
Electronic Edition (link) BibTeX
- H. C. Yeo, N. Guo, H. Du, W. M. Huang, X. M. Jian:
Characterisation of IC packaging interfaces and loading effects.
1892-1897
Electronic Edition (link) BibTeX
Volume 46,
Number 12,
December 2006
Introductory Invited Papers
- Juan C. Ranuárez, M. Jamal Deen, Chih-Hung Chen:
A review of gate tunneling current in MOS devices.
1939-1956
Electronic Edition (link) BibTeX
- Joseph B. Bernstein, Moshe Gurfinkel, Xiaojun Li, Jörg Walters, Yoram Shapira, Michael Talmor:
Electronic circuit reliability modeling.
1957-1979
Electronic Edition (link) BibTeX
- Axel Sikora, Frank-Peter Pesl, Walter Unger, Uwe Paschen:
Technologies and reliability of modern embedded flash cells.
1980-2005
Electronic Edition (link) BibTeX
- Reza Ghaffarian:
CCGA packages for space applications.
2006-2024
Electronic Edition (link) BibTeX
Research Papers
- Hou-Kuei Huang, Chou-Sern Wang, Mau-Phon Houng, Yeong-Her Wang:
Hot-electron effects on AlGaAs/InGaAs/GaAs PHEMTs under accelerated DC stresses.
2025-2031
Electronic Edition (link) BibTeX
- D. H. Tassis, A. T. Hatzopoulos, N. Arpatzanis, C. A. Dimitriadis, G. Kamarinos:
Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors.
2032-2037
Electronic Edition (link) BibTeX
- Hou-Kuei Huang, Cieh-Pin Chang, Mau-Phon Houng, Yeong-Her Wang:
Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs.
2038-2043
Electronic Edition (link) BibTeX
- B. L. Yang, Paul C. K. Kwok, P. T. Lai:
Influence of TCE concentration in thermal oxidation on reliability of SiC MOS capacitors under Fowler-Nordheim electron injection.
2044-2048
Electronic Edition (link) BibTeX
- Baozhen Li, Emmanuel Yashchin, Cathryn Christiansen, Jason Gill, Ronald Filippi, Timothy D. Sullivan:
Application of three-parameter lognormal distribution in EM data analysis.
2049-2055
Electronic Edition (link) BibTeX
- C. K. Wong, H. Wong, M. Chan, C. W. Kok, H. P. Chan:
Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride.
2056-2061
Electronic Edition (link) BibTeX
- Z. W. He, X. Q. Liu, D. Y. Xu, Y. Y. Wang:
Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol-gel method with catalyst HF.
2062-2066
Electronic Edition (link) BibTeX
- Chih-Kang Deng, Ming-Dou Ker:
ESD robustness of thin-film devices with different layout structures in LTPS technology.
2067-2073
Electronic Edition (link) BibTeX
- Yang-Hua Chang, Hui-Fen Hsu:
Determination of thermal resistance using Gummel measurement for InGaP/GaAs HBTs.
2074-2078
Electronic Edition (link) BibTeX
- Anna Kozlowska, Andrzej Malag:
Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions.
2079-2084
Electronic Edition (link) BibTeX
- Hirotaka Komoda, Masaaki Yoshida, Yoh Yamamoto, Kouji Iwasaki, Ikuko Nakatani, Heiji Watanabe, Kiyoshi Yasutake:
Novel charge neutralization techniques applicable to wide current range of FIB processing in FIB-SEM combined system.
2085-2095
Electronic Edition (link) BibTeX
- E. Misra, N. D. Theodore, J. W. Mayer, T. L. Alford:
Failure mechanisms of pure silver, pure aluminum and silver-aluminum alloy under high current stress.
2096-2103
Electronic Edition (link) BibTeX
- Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
2104-2111
Electronic Edition (link) BibTeX
- C. D. Breach, F. Wulff:
Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175degreeC.
2112-2121
Electronic Edition (link) BibTeX
- Stephen Ridout, Milos Dusek, Chris Bailey, Chris Hunt:
Assessing the performance of crack detection tests for solder joints.
2122-2130
Electronic Edition (link) BibTeX
- Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong:
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.
2131-2138
Electronic Edition (link) BibTeX
- Ming-Hung Shu, Ching-Hsue Cheng, Jing-Rong Chang:
Using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly.
2139-2148
Electronic Edition (link) BibTeX
- Reza Sedaghat, Mayuri Kunchwar, Raha Abedi, M. Reza Javaheri:
Transistor-level to gate-level comprehensive fault synthesis for n-input primitive gates.
2149-2158
Electronic Edition (link) BibTeX
Errata
Copyright © Sun May 17 00:14:15 2009
by Michael Ley (ley@uni-trier.de)
