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2006 | ||
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2 | EE | Yuqi Wang, K. H. Low, H. L. J. Pang, K. H. Hoon, F. X. Che, Y. S. Yong: Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectronics Reliability 46(2-4): 558-573 (2006) |
1 | EE | Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low: Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectronics Reliability 46(7): 1160-1171 (2006) |
1 | Desmond Y. R. Chong | [1] |
2 | K. H. Hoon | [2] |
3 | K. H. Low | [2] |
4 | Patrick T. H. Low | [1] |
5 | Kellin Ng | [1] |
6 | H. L. J. Pang | [2] |
7 | John H. L. Pang | [1] |
8 | Jane Y. N. Tan | [1] |
9 | Yuqi Wang | [2] |
10 | Y. S. Yong | [2] |