M. Y. Pan

2006
1	EE	M. Y. Pan, M. Gupta, A. A. O. Tay, K. Vaidyanathan: Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Microelectronics Reliability 46(5-6): 763-767 (2006)

Coauthor Index

1	M. Gupta	[1]
2	A. A. O. Tay	[1]
3	K. Vaidyanathan	[1]