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M. Y. Pan

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2006
1EEM. Y. Pan, M. Gupta, A. A. O. Tay, K. Vaidyanathan: Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Microelectronics Reliability 46(5-6): 763-767 (2006)

Coauthor Index

1M. Gupta [1]
2A. A. O. Tay [1]
3K. Vaidyanathan [1]

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