| |
| 2006 | ||
|---|---|---|
| 6 | EE | William J. Roesch: Historical review of compound semiconductor reliability. Microelectronics Reliability 46(8): 1218-1227 (2006) |
| 5 | EE | William J. Roesch: Compound semiconductor activation energy in humidity. Microelectronics Reliability 46(8): 1238-1246 (2006) |
| 2005 | ||
| 4 | EE | William J. Roesch, Dorothy June M. Hamada: Metal defect yield and reliability relationships. Microelectronics Reliability 45(12): 1875-1881 (2005) |
| 2004 | ||
| 3 | EE | William J. Roesch, Suwanna Jittinorasett: Cycling copper flip chip interconnects. Microelectronics Reliability 44(7): 1047-1054 (2004) |
| 2002 | ||
| 2 | EE | William J. Roesch: Methods of reducing defects in GaAs ICs. Microelectronics Reliability 42(7): 1029-1036 (2002) |
| 2001 | ||
| 1 | EE | William J. Roesch: Volume impacts on GaAs reliability improvement. Microelectronics Reliability 41(8): 1123-1127 (2001) |
| 1 | Dorothy June M. Hamada | [4] |
| 2 | Suwanna Jittinorasett | [3] |