| |
| 2006 | ||
|---|---|---|
| 3 | EE | M. Wagner, W. Unger, W. Wondrak: Part average analysis - A tool for reducing failure rates in automotive electronics. Microelectronics Reliability 46(9-11): 1433-1438 (2006) |
| 2005 | ||
| 2 | EE | A. Dehbi, Y. Ousten, Y. Danto, W. Wondrak: Vibration lifetime modelling of PCB assemblies using steinberg model. Microelectronics Reliability 45(9-11): 1658-1661 (2005) |
| 2002 | ||
| 1 | EE | A. Dehbi, W. Wondrak, Y. Ousten, Y. Danto: High temperature reliability testing of aluminum and tantalum electrolytic capacitors. Microelectronics Reliability 42(6): 835-840 (2002) |
| 1 | Y. Danto | [1] [2] |
| 2 | A. Dehbi | [1] [2] |
| 3 | Y. Ousten | [1] [2] |
| 4 | W. Unger | [3] |
| 5 | M. Wagner | [3] |