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Yi-Shao Lai

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2007
12EEYi-Shao Lai, Tong Hong Wang: Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 104-110 (2007)
11EEYi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen: Cyclic bending reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 111-117 (2007)
2006
10EEChang-Lin Yeh, Yi-Shao Lai: Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectronics Reliability 46(2-4): 626-636 (2006)
9EEYi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectronics Reliability 46(2-4): 645-650 (2006)
8EEYi-Shao Lai: On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. Microelectronics Reliability 46(5-6): 859-863 (2006)
7EEChang-Lin Yeh, Yi-Shao Lai: Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectronics Reliability 46(5-6): 885-895 (2006)
6EEYi-Shao Lai, Chin-Li Kao: Characteristics of current crowding in flip-chip solder bumps. Microelectronics Reliability 46(5-6): 915-922 (2006)
5EEChang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao: Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability 46(7): 1172-1182 (2006)
4EEYi-Shao Lai, Chin-Li Kao: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectronics Reliability 46(8): 1357-1368 (2006)
2005
3EEChang-Lin Yeh, Yi-Shao Lai: Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectronics Reliability 45(2): 371-378 (2005)
2EEYi-Shao Lai, Tong Hong Wang: Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectronics Reliability 45(3-4): 575-582 (2005)
1993
1 Ray-Shyan Wu, Yi-Shao Lai: An Observation on Fractal Characteristics of Individual River Plan Forms. Fractals in the Natural and Applied Sciences 1993: 441-451

Coauthor Index

1Ming-Hwa R. Jen [11]
2Chin-Li Kao [4] [5] [6]
3Han-Hui Tsai [11]
4Tong Hong Wang [2] [11] [12]
5Ray-Shyan Wu [1]
6Ping-Feng Yang [9]
7Chang-Lin Yeh [3] [5] [7] [9] [10]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)