| 2007 |
|---|
| 12 | EE | Yi-Shao Lai,
Tong Hong Wang:
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages.
Microelectronics Reliability 47(1): 104-110 (2007) |
| 11 | EE | Yi-Shao Lai,
Tong Hong Wang,
Han-Hui Tsai,
Ming-Hwa R. Jen:
Cyclic bending reliability of wafer-level chip-scale packages.
Microelectronics Reliability 47(1): 111-117 (2007) |
| 2006 |
|---|
| 10 | EE | Chang-Lin Yeh,
Yi-Shao Lai:
Support excitation scheme for transient analysis of JEDEC board-level drop test.
Microelectronics Reliability 46(2-4): 626-636 (2006) |
| 9 | EE | Yi-Shao Lai,
Ping-Feng Yang,
Chang-Lin Yeh:
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.
Microelectronics Reliability 46(2-4): 645-650 (2006) |
| 8 | EE | Yi-Shao Lai:
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials.
Microelectronics Reliability 46(5-6): 859-863 (2006) |
| 7 | EE | Chang-Lin Yeh,
Yi-Shao Lai:
Transient fracturing of solder joints subjected to displacement-controlled impact loads.
Microelectronics Reliability 46(5-6): 885-895 (2006) |
| 6 | EE | Yi-Shao Lai,
Chin-Li Kao:
Characteristics of current crowding in flip-chip solder bumps.
Microelectronics Reliability 46(5-6): 915-922 (2006) |
| 5 | EE | Chang-Lin Yeh,
Yi-Shao Lai,
Chin-Li Kao:
Evaluation of board-level reliability of electronic packages under consecutive drops.
Microelectronics Reliability 46(7): 1172-1182 (2006) |
| 4 | EE | Yi-Shao Lai,
Chin-Li Kao:
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages.
Microelectronics Reliability 46(8): 1357-1368 (2006) |
| 2005 |
|---|
| 3 | EE | Chang-Lin Yeh,
Yi-Shao Lai:
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers.
Microelectronics Reliability 45(2): 371-378 (2005) |
| 2 | EE | Yi-Shao Lai,
Tong Hong Wang:
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly.
Microelectronics Reliability 45(3-4): 575-582 (2005) |
| 1993 |
|---|
| 1 | | Ray-Shyan Wu,
Yi-Shao Lai:
An Observation on Fractal Characteristics of Individual River Plan Forms.
Fractals in the Natural and Applied Sciences 1993: 441-451 |
